A42MX09-1TQG176M

IC FPGA 104 I/O 176TQFP
Part Description

MX Field Programmable Gate Array (FPGA) IC 104 176-LQFP

Quantity 540 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package176-TQFP (24x24)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case176-LQFPNumber of I/O104Voltage3 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs684Number of Logic Elements/Cells336
Number of Gates14000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/A

Overview of A42MX09-1TQG176M – MX Field Programmable Gate Array (FPGA) IC 104 176-LQFP

The A42MX09-1TQG176M is an MX-family Field Programmable Gate Array (FPGA) offered in a 176-LQFP package. It provides a compact, programmable logic solution with a mix of logic capacity, I/O density and wide operating temperature suited to demanding environments.

This device targets designers who need military-grade temperature performance and a flexible I/O footprint, delivering up to 104 user I/O lines, approximately 14,000 gates and 336 logic elements in a surface-mount 176-pin LQFP package.

Key Features

  • Core Logic  Approximately 336 logic elements and around 14,000 gates provide the programmable building blocks for custom logic and control functions.
  • I/O Density  104 general-purpose I/O pins enable broad interfacing options for sensors, peripherals and system buses.
  • Voltage Range  Operates from 3 V to 5.5 V, allowing compatibility with a wide range of legacy and modern I/O voltage domains.
  • Package & Mounting  Available in a 176-LQFP surface-mount package (supplier package 176-TQFP, 24×24 mm) for PCB designs requiring a compact footprint and high pin count.
  • Temperature & Grade  Military-grade device rated for operation from −55 °C to 125 °C, suitable for temperature-extreme environments.
  • Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

  • Military and Defense Electronics  Used where military-grade temperature range and rugged operation are required for custom logic, protocol bridging and I/O aggregation.
  • Embedded Control Systems  Deploy as a programmable controller or glue-logic device in embedded platforms needing flexible I/O and custom state machines.
  • Communications Interfaces  Implement protocol conversion, bus interfacing and I/O expansion functions leveraging the device’s 104 I/O lines and programmable logic.

Unique Advantages

  • Military-Grade Temperature Range:  Rated −55 °C to 125 °C to meet thermal requirements for rugged and defense applications.
  • Flexible I/O Count:  104 I/O pins provide the signal density needed to consolidate multiple peripheral interfaces onto a single FPGA.
  • Compact, High-Pin Package:  176-LQFP (24×24 mm) package balances high pin count with a compact PCB footprint for space-constrained designs.
  • Broad Supply Voltage Window:  3 V to 5.5 V operation allows integration with a variety of logic families and mixed-voltage systems.
  • Regulatory Compliance:  RoHS compliance supports lead-free manufacturing requirements.

Why Choose A42MX09-1TQG176M?

The A42MX09-1TQG176M combines a practical logic capacity with a robust thermal specification and a high I/O count in a standardized 176-LQFP package. It is positioned for designs that require programmable logic in environments that demand wide temperature tolerance and reliable, surface-mount packaging.

This device is well suited to engineers building military, ruggedized and embedded systems who need a dependable, RoHS-compliant FPGA option that supports a range of supply voltages and extensive I/O integration without sacrificing board space.

Request a quote or submit your requirements to receive pricing and availability information for the A42MX09-1TQG176M.

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