A42MX09-3PQG100
| Part Description |
MX Field Programmable Gate Array (FPGA) IC 83 100-BQFP |
|---|---|
| Quantity | 1,719 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-PQFP (20x14) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-BQFP | Number of I/O | 83 | Voltage | 3 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 684 | Number of Logic Elements/Cells | 336 | ||
| Number of Gates | 14000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A42MX09-3PQG100 – MX Field Programmable Gate Array (FPGA) IC 83 100-BQFP
The A42MX09-3PQG100 is a Microchip Technology MX-series field programmable gate array (FPGA) in a 100-pin BQFP package. It provides programmable logic resources and general-purpose I/O in a compact surface-mount form factor for commercial embedded designs.
With 336 logic elements (approximately 14,000 gates) and up to 83 I/O pins, this device is intended for applications that require mid-density programmable logic, flexible I/O connectivity and a 3.0 V to 5.25 V supply range.
Key Features
- Programmable Logic — 336 logic elements and approximately 14,000 gates for implementing combinational and sequential logic functions.
- I/O Capacity — 83 general-purpose I/O pins to support multiple peripheral interfaces and board-level signal routing.
- Memory — Total RAM bits: 0 (no embedded user RAM reported).
- Power Supply — Operates from a 3.0 V to 5.25 V supply range to match common digital power rails.
- Package & Mounting — 100-BQFP package case; supplier device package listed as 100-PQFP (20×14). Surface-mount mounting type for board-level integration.
- Operating Temperature — Commercial grade operation from 0 °C to 70 °C.
- Compliance — RoHS compliant for lead-free assembly and environmental regulatory compliance.
Typical Applications
- Commercial Embedded Systems — Programmable logic for mid-density control and signal processing tasks within commercial electronic products operating in standard temperature ranges.
- I/O Expansion and Glue Logic — Implement board-level interfacing, signal routing, and glue logic where up to 83 I/Os are required.
- Prototype and Development — Useful for evaluation and development of logic functions in projects that require a compact FPGA in a 100-pin BQFP package.
Unique Advantages
- Balanced Logic Density: 336 logic elements and ~14,000 gates provide sufficient capacity for mid-range logic implementations without excessive board space.
- Generous I/O Count: 83 I/O pins give designers flexibility to connect multiple peripherals and interfaces directly to the FPGA.
- Wide Supply Compatibility: 3.0 V to 5.25 V operating range accommodates a variety of common digital power domains.
- Compact Surface-Mount Package: 100-BQFP (supplier package 100-PQFP 20×14) allows dense PCB layouts and straightforward assembly.
- Commercial Temperature Rating: Rated for 0 °C to 70 °C operation to match a broad set of commercial applications.
- RoHS Compliant: Meets lead-free assembly requirements for environmentally conscious designs.
Why Choose A42MX09-3PQG100?
The A42MX09-3PQG100 positions itself as a mid-density, commercial-grade FPGA offering a practical mix of logic resources and I/O capacity in a compact 100-pin surface-mount package. Its voltage flexibility and RoHS compliance simplify integration into mainstream electronic designs.
This device is well suited to designers and OEMs who need programmable logic for control, interface consolidation, or prototype development where a commercial temperature range and moderate logic density meet project requirements. The A42MX09-3PQG100 provides a straightforward option when compact packaging, flexible I/O, and standard supply compatibility are key considerations.
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