A42MX16-WAFERLOT
| Part Description |
MX Field Programmable Gate Array (FPGA) IC 608 Die |
|---|---|
| Quantity | 318 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 4 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | Wafer | Grade | Automotive | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Die | Number of I/O | N/A | Voltage | 3 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 1232 | Number of Logic Elements/Cells | 608 | ||
| Number of Gates | 24000 | ECCN | N/A | HTS Code | N/A | ||
| Qualification | AEC-Q100 |
Overview of A42MX16-WAFERLOT – MX Field Programmable Gate Array (FPGA) IC 608 Die
The A42MX16-WAFERLOT is a Field Programmable Gate Array (FPGA) die from Microchip Technology provided in wafer format for integration into custom assembly flows. It combines a compact logic fabric with 24,000 gates and 608 logic elements to enable configurable digital functions for volume manufacturing.
Designed and qualified for automotive use, this AEC-Q100-rated die supports aggressive temperature and voltage environments, making it suitable for designs that require reliable programmable logic in harsh conditions.
Key Features
- Core Logic: 608 logic elements and approximately 24,000 gates provide a programmable fabric for implementing custom digital logic, glue logic, and control functions.
- Qualification & Grade: Automotive grade with AEC-Q100 qualification and an operating temperature range of −55 °C to 125 °C for use in demanding vehicle environments.
- Power & I/O Flexibility: Wide supply range from 3 V to 5.5 V to simplify interfacing with a variety of automotive and embedded power domains.
- Packaging & Supply Form: Supplied as a die in wafer format, enabling wafer-level procurement and custom packaging or integration into automated assembly processes.
- Mounting Type: Surface mount die options suitable for automated placement and high-volume production workflows.
- Environmental Compliance: RoHS compliant for alignment with environmental and regulatory requirements.
Typical Applications
- Automotive Control Systems: Implement custom logic for ECU functions, sensor interfacing, and vehicle sub-systems where AEC-Q100 qualification and wide temperature range are required.
- High‑Volume Manufacturing: Wafer-format supply streamlines integration into automated packaging and production lines for OEMs and contract manufacturers.
- Embedded Logic Integration: Replace discrete glue logic or create configurable control blocks in compact electronics where board real estate and customization matter.
- Custom Signal Conditioning and Interface Logic: Implement protocol conversion, timing control, and peripheral interfacing tailored to system requirements.
Unique Advantages
- AEC-Q100 Automotive Qualification: Proven qualification for automotive environments reduces design risk for vehicle electronics applications.
- Wafer-Level Availability: Supplied as a die on wafer, facilitating direct integration into advanced packaging flows and enabling cost-effective scaling for high-volume production.
- Wide Supply Voltage Range: Operation from 3 V to 5.5 V simplifies integration with existing vehicle and embedded power rails without extensive level-shifting.
- Compact, Configurable Logic Capacity: 608 logic elements and ~24k gates provide a balance of programmable capability and compact die area for custom control and interface tasks.
- Wide Operating Temperature Range: −55 °C to 125 °C capability supports deployment in temperature-extreme environments found in automotive applications.
- Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for modern electronics manufacturing.
Why Choose A42MX16-WAFERLOT?
The A42MX16-WAFERLOT positions itself as a reliable, automotive-qualified FPGA die for designers who need configurable logic in demanding environments. Its combination of 608 logic elements, 24,000 gates, AEC-Q100 qualification, and a wide operating temperature and voltage window make it well suited for vehicle electronics, high-volume OEM production, and embedded control tasks that require programmable flexibility with automotive robustness.
Available in wafer format from Microchip Technology, this FPGA die supports production workflows that prioritize custom packaging, automated assembly, and long-term program scalability while meeting environmental compliance expectations.
Request a quote or submit a sales inquiry to receive pricing, availability, and wafer-lot procurement information for the A42MX16-WAFERLOT.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D