EX256-TQG100I

IC FPGA 81 I/O 100TQFP
Part Description

EX Field Programmable Gate Array (FPGA) IC 81 512 100-LQFP

Quantity 23 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case100-LQFPNumber of I/O81Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs256Number of Logic Elements/Cells512
Number of Gates12000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EX256-TQG100I – EX Field Programmable Gate Array (FPGA) IC 81 512 100-LQFP

The EX256-TQG100I is a field programmable gate array (FPGA) from Microchip Technology designed for industrial applications. It delivers a compact, surface-mount FPGA solution with a defined logic capacity and I/O count for embedded designs that operate across an industrial temperature range.

With its combination of logic resources, I/O density and a 100-pin LQFP/TQFP package, the EX256-TQG100I is suited to designs that require deterministic pin access, controlled supply voltage operation and RoHS-compliant manufacturing.

Key Features

  • Core Logic — Provides 512 logic elements with an overall gate equivalent of 12,000 gates for implementing custom logic and control functions.
  • I/O Density — 81 I/O pins to support multiple peripheral and interface connections in a single-device implementation.
  • Package & Mounting — Supplied in a 100-LQFP package case and listed as 100-TQFP (14×14) supplier device package; designed for surface-mount assembly.
  • Power — Operates from a 2.3 V to 2.7 V supply range to match system power requirements within that window.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C, supporting deployment in industrial environments.
  • Regulatory — RoHS compliant, enabling lead-free manufacturing processes.

Typical Applications

  • Industrial Control Modules — Suitable for control and logic tasks in systems that require operation across −40 °C to 85 °C and RoHS-compliant components.
  • Embedded Interface and Glue Logic — Acts as a compact programmable fabric for bridging peripherals and managing I/O with its 81 available I/O pins.
  • Custom Logic Implementations — Use where up to 512 logic elements and around 12,000 gate equivalents are sufficient to realize tailored control or signal-processing functions.

Unique Advantages

  • Deterministic I/O Count: 81 I/O pins provide clear pin availability for system interfacing and deterministic board-level routing.
  • Compact Surface-Mount Package: 100-pin LQFP/TQFP packaging enables high-density PCB layouts while supporting standard surface-mount assembly.
  • Industrial Temperature Compatibility: Rated −40 °C to 85 °C to meet the environmental requirements of many industrial installations.
  • Clear Power Envelope: Defined 2.3 V to 2.7 V supply requirement simplifies power supply selection and validation for the target system.
  • RoHS Compliance: Supports lead-free manufacturing and end-product regulatory requirements.

Why Choose EX256-TQG100I?

The EX256-TQG100I is positioned as a compact, industrial-grade FPGA option when designers need a known logic capacity, a moderate I/O complement and a standard 100-pin LQFP/TQFP package. Its combination of 512 logic elements, approximately 12,000 gate equivalents and 81 I/O pins makes it suitable for embedded control, interface bridging and bespoke logic tasks in industrial settings.

For teams targeting reliable, RoHS-compliant hardware that must operate across an industrial temperature range and within a defined 2.3 V–2.7 V supply window, the EX256-TQG100I offers a focused balance of integration, packaging and environmental suitability.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the EX256-TQG100I.

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