LCMXO2-1200HC-6MG132C

IC FPGA 104 I/O 132CSBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 104 65536 1280 132-LFBGA, CSPBGA

Quantity 514 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O104Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200HC-6MG132C – MachXO2 FPGA, 1280 logic elements, 65,536-bit RAM, 104 I/Os, 132-LFBGA

The LCMXO2-1200HC-6MG132C is a MachXO2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It combines a flexible logic fabric with on-chip memory and a broad range of programmable I/O to support system control, interface bridging, and embedded glue-logic functions.

This surface-mount FPGA offers 1280 logic elements, approximately 65 kbits of embedded RAM, and 104 user I/Os in a 132-ball LFBGA (8×8 CSPBGA) package, making it suitable for compact commercial designs requiring non-volatile, reconfigurable logic and integrated system functions.

Key Features

  • Core Logic — 1280 logic elements provide a moderate-density fabric for control, glue logic, and peripheral offload.
  • Embedded Memory — Approximately 65 kbits (65,536 bits) of on-chip RAM for FIFOs, state storage, and small data buffers.
  • On-Chip User Flash — Family support for up to 64 kbits of user flash memory and background programming; suitable for single-chip non-volatile configuration and in-field updates.
  • I/O Flexibility — 104 user I/Os with programmable buffer options and support for a wide range of interfaces, enabling sensor, display, and peripheral connectivity.
  • Power and Low-Power Modes — Single power-supply operation with a voltage range of 2.375 V to 3.465 V and ultra-low standby options noted in the family specifications.
  • Reconfiguration and Security — Non-volatile instant-on behavior and support for background and dual-boot programming modes for secure, in-field reconfiguration.
  • Clocking and Timing — Family-level support for multiple primary clocks and analog PLLs for flexible clock generation (per MachXO2 family datasheet).
  • Package and Mounting — 132-LFBGA (8×8 CSPBGA) surface-mount package for compact board integration; RoHS compliant.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.

Typical Applications

  • Interface Bridging — Implements protocol conversion and I/O aggregation for systems that require flexible signal conditioning and peripheral interfacing.
  • System Control and Glue Logic — Replaces discrete logic in control paths and coordinates peripherals using on-chip flash and embedded RAM for configuration and state management.
  • Peripheral and Sensor Interfacing — Handles sensor aggregation, timing, and buffering tasks using available I/Os and embedded memory.
  • Display and I/O Timing — Supports display gearing and pre-engineered source-synchronous I/O features from the MachXO2 family for timing-critical user interfaces.

Unique Advantages

  • Non-volatile, Instant-On Operation: Powers up in microseconds and retains configuration in on-chip flash, simplifying board-level startup and eliminating the need for external configuration memory.
  • Integrated Memory and Logic: Combined logic elements and approximately 65 kbits of embedded RAM reduce external component count for control and buffering functions.
  • Flexible I/O with Programmability: Wide I/O programmability supports multiple signaling standards and enables adaptable interfaces across designs.
  • Low Standby Power Options: Family-level ultra-low standby power modes are available, supporting power-sensitive commercial applications.
  • In-Field Reconfiguration: Background programming and TransFR reconfiguration options allow firmware updates and logic changes without taking the entire system offline.
  • Compact, RoHS-Compliant Packaging: 132-ball LFBGA (CSPBGA) package provides a small footprint suitable for space-constrained designs while meeting RoHS requirements.

Why Choose LCMXO2-1200HC-6MG132C?

The LCMXO2-1200HC-6MG132C delivers a balanced combination of moderate logic density, embedded memory, and flexible I/O in a compact, surface-mount package. Its non-volatile configuration and family-level features such as on-chip flash, background programming, and low-power modes make it a practical choice for commercial designs that require reliable, reconfigurable logic without external configuration components.

Designers building control subsystems, interface bridges, or compact embedded systems will benefit from the MachXO2 architecture’s blend of integration and configurability, enabling simplified BOMs and streamlined board layouts with support for in-field updates and secure single-chip configuration.

Request a quote or submit a procurement inquiry to evaluate the LCMXO2-1200HC-6MG132C for your next design.

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