LCMXO256E-4MN100C

IC FPGA 78 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA

Quantity 1,192 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LFBGA, CSPBGANumber of I/O78Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32Number of Logic Elements/Cells256
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO256E-4MN100C – MachXO Field Programmable Gate Array (FPGA) IC, 78 I/Os, 256 logic elements, 100-LFBGA

The LCMXO256E-4MN100C is a MachXO-family FPGA IC optimized for compact glue-logic and control functions. It delivers 256 logic elements in a non-volatile, surface-mount 100-ball LFBGA/CSPBGA package with 78 user I/Os, making it suitable for board-level interfacing, power-up sequencing, and control-logic roles in commercial electronic designs.

Built on the MachXO architecture, this device supports single-chip instant-on configuration and in-field reconfiguration features from the family datasheet, while providing a commercial temperature grade and RoHS-compliant packaging for standard embedded applications.

Key Features

  • Logic Capacity — 256 logic elements for implementing glue logic, bus interfacing, and control functions with deterministic, small-footprint designs.
  • I/O Density — 78 general-purpose I/Os available in the 100-LFBGA/CSPBGA package to support multiple peripheral and bus connections.
  • Non-volatile Configuration — MachXO family single-chip, non-volatile architecture enables instant-on operation and eliminates the need for external configuration memory.
  • Reconfiguration and Programming — Supports in-system programming and background programming of non-volatile memory through JTAG and family TransFR™ reconfiguration capability for field updates (family-level feature).
  • Power and IO Flexibility — Core supply range specified at 1.14 V to 1.26 V; family-level programmable I/O buffer support for common logic standards (refer to family datasheet for supported I/O voltage levels and standards).
  • No Embedded Block SRAM — This device does not include dedicated embedded block SRAM (EBR), simplifying deterministic control and glue-logic implementations.
  • Zero PLLs — The LCMXO256 variant does not include analog PLLs (family selection table entry), suitable for designs that do not require on-chip clock multiplication.
  • Package and Mounting — Surface-mount 100-LFBGA / 100-CSBGA (8×8 mm) package optimized for compact board layouts and automated assembly.
  • Commercial Grade and Temperature Range — Rated for commercial operation from 0 °C to 85 °C.
  • RoHS Compliant — Lead-free packaging to meet standard environmental requirements.

Typical Applications

  • Glue Logic — Implement address decoding, bus arbitration, and small combinational/sequential logic blocks to reduce discrete gate count and simplify PCBs.
  • Bus Bridging and Interfacing — Bridge mismatched buses or manage protocol translation with abundant I/Os in a small package footprint.
  • Power-up and Reset Control — Centralize power sequencing and reset supervision logic using non-volatile, instant-on configuration for predictable system startup.
  • Control Logic — Replace multiple discrete controllers with a single programmable device for state machines, feature gating, and peripheral control.

Unique Advantages

  • Single-chip Instant-On: Non-volatile configuration eliminates external config memory and enables immediate operation after power-up, reducing system complexity.
  • Compact, High I/O Density: 78 I/Os in a 100-ball CSP/LFBGA package allow rich interfacing capability without a large BGA or TQFP footprint.
  • Simplified BOM and Layout: Integrating glue logic and control functions into a single MachXO device reduces discrete components and saves PCB area.
  • Field Reprogrammability: In-system programming and family TransFR™ reconfiguration support allow updates to logic while in the field, improving product flexibility.
  • Commercial-ready: Commercial temperature grading and RoHS-compliant packaging suit a wide range of mainstream electronic products.

Why Choose LCMXO256E-4MN100C?

The LCMXO256E-4MN100C positions itself as a compact, non-volatile FPGA solution for designers who need reliable glue logic, bus interfacing, and control functions in a small surface-mount package. With 256 logic elements, 78 I/Os, instant-on configuration, and family-level reconfiguration capabilities, it reduces system BOM and simplifies power-up and in-field update scenarios.

This device is well suited to commercial embedded systems where compact size, predictable startup behavior, and flexible in-system programming are priorities. Use it to replace multiple discrete components, consolidate control logic, and streamline board design while taking advantage of the MachXO family programming ecosystem and tooling.

Request a quote or submit an inquiry to receive current pricing, lead times, and availability for the LCMXO256E-4MN100C.

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