LCMXO256E-4MN100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,192 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LFBGA, CSPBGA | Number of I/O | 78 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32 | Number of Logic Elements/Cells | 256 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO256E-4MN100C – MachXO Field Programmable Gate Array (FPGA) IC, 78 I/Os, 256 logic elements, 100-LFBGA
The LCMXO256E-4MN100C is a MachXO-family FPGA IC optimized for compact glue-logic and control functions. It delivers 256 logic elements in a non-volatile, surface-mount 100-ball LFBGA/CSPBGA package with 78 user I/Os, making it suitable for board-level interfacing, power-up sequencing, and control-logic roles in commercial electronic designs.
Built on the MachXO architecture, this device supports single-chip instant-on configuration and in-field reconfiguration features from the family datasheet, while providing a commercial temperature grade and RoHS-compliant packaging for standard embedded applications.
Key Features
- Logic Capacity — 256 logic elements for implementing glue logic, bus interfacing, and control functions with deterministic, small-footprint designs.
- I/O Density — 78 general-purpose I/Os available in the 100-LFBGA/CSPBGA package to support multiple peripheral and bus connections.
- Non-volatile Configuration — MachXO family single-chip, non-volatile architecture enables instant-on operation and eliminates the need for external configuration memory.
- Reconfiguration and Programming — Supports in-system programming and background programming of non-volatile memory through JTAG and family TransFR™ reconfiguration capability for field updates (family-level feature).
- Power and IO Flexibility — Core supply range specified at 1.14 V to 1.26 V; family-level programmable I/O buffer support for common logic standards (refer to family datasheet for supported I/O voltage levels and standards).
- No Embedded Block SRAM — This device does not include dedicated embedded block SRAM (EBR), simplifying deterministic control and glue-logic implementations.
- Zero PLLs — The LCMXO256 variant does not include analog PLLs (family selection table entry), suitable for designs that do not require on-chip clock multiplication.
- Package and Mounting — Surface-mount 100-LFBGA / 100-CSBGA (8×8 mm) package optimized for compact board layouts and automated assembly.
- Commercial Grade and Temperature Range — Rated for commercial operation from 0 °C to 85 °C.
- RoHS Compliant — Lead-free packaging to meet standard environmental requirements.
Typical Applications
- Glue Logic — Implement address decoding, bus arbitration, and small combinational/sequential logic blocks to reduce discrete gate count and simplify PCBs.
- Bus Bridging and Interfacing — Bridge mismatched buses or manage protocol translation with abundant I/Os in a small package footprint.
- Power-up and Reset Control — Centralize power sequencing and reset supervision logic using non-volatile, instant-on configuration for predictable system startup.
- Control Logic — Replace multiple discrete controllers with a single programmable device for state machines, feature gating, and peripheral control.
Unique Advantages
- Single-chip Instant-On: Non-volatile configuration eliminates external config memory and enables immediate operation after power-up, reducing system complexity.
- Compact, High I/O Density: 78 I/Os in a 100-ball CSP/LFBGA package allow rich interfacing capability without a large BGA or TQFP footprint.
- Simplified BOM and Layout: Integrating glue logic and control functions into a single MachXO device reduces discrete components and saves PCB area.
- Field Reprogrammability: In-system programming and family TransFR™ reconfiguration support allow updates to logic while in the field, improving product flexibility.
- Commercial-ready: Commercial temperature grading and RoHS-compliant packaging suit a wide range of mainstream electronic products.
Why Choose LCMXO256E-4MN100C?
The LCMXO256E-4MN100C positions itself as a compact, non-volatile FPGA solution for designers who need reliable glue logic, bus interfacing, and control functions in a small surface-mount package. With 256 logic elements, 78 I/Os, instant-on configuration, and family-level reconfiguration capabilities, it reduces system BOM and simplifies power-up and in-field update scenarios.
This device is well suited to commercial embedded systems where compact size, predictable startup behavior, and flexible in-system programming are priorities. Use it to replace multiple discrete components, consolidate control logic, and streamline board design while taking advantage of the MachXO family programming ecosystem and tooling.
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