LFE5U-45F-6BG554C

The LFE5U-45F-6BG554C is a commercial-grade FPGA device from the Lattice ECP5 family. It combines high I/O density, substantial logic capacity and on-chip RAM in a 554-ball FBGA package targeted at space-constrained, board-level digital designs.

With 44,000 logic elements, approximately 1.99 Mbits of embedded memory and 245 I/Os, this device is positioned for applications that require mid-range programmable logic, flexible I/O and the architectural capabilities provided by the ECP5 family.

Key Features

• Logic Capacity — 44,000 logic elements to implement combinational and sequential logic, state machines and glue logic at board level.
• On-chip Memory — Approximately 1.99 Mbits of embedded RAM for data buffering, FIFOs and small on-chip storage.
• I/O Density — 245 programmable I/Os to support multi-channel interfaces and dense board connectivity.
• Package & Mounting — 554-ball FBGA (554-CABGA, 23 × 23 mm) in a surface-mount package for compact PCB layouts.
• Power Supply — Core voltage specified between 1.045 V and 1.155 V to match system power rails and design constraints.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Family Architecture (ECP5) — ECP5 family-level capabilities documented in the datasheet include programmable clocking (PLL), DDR memory support, sysDSP slice architecture, SERDES and on-chip oscillator options, enabling a range of system-level functions.
• Regulatory — RoHS compliant.

Typical Applications

• Communications and Connectivity — Use the device’s 245 I/Os and ECP5 family SERDES/DDR support to implement protocol bridging, multi-lane interfaces and I/O translation on compact boards.
• Video and Imaging Subsystems — On-chip memory and programmable logic can be applied to frame buffering, interface handling and custom pre/post-processing blocks.
• Industrial Control and Automation — The 44,000 logic elements and abundant I/Os enable motor-control logic, sensor aggregation and deterministic I/O handling in commercial automation equipment.
• Prototyping and Custom Logic — Suitable for board-level prototypes and designs requiring reconfigurable logic, glue logic and peripheral control within a commercial temperature range.

Unique Advantages

• High logic density with modest footprint: 44,000 logic elements deliver substantial programmable logic capacity while maintaining a compact 554-FBGA package.
• Generous I/O count: 245 I/Os reduce the need for external multiplexing or bridging for multi-channel designs, simplifying PCB routing and BOM.
• Embedded memory for on-chip buffering: Approximately 1.99 Mbits of RAM supports local data storage, FIFO implementations and temporary buffering without external memory in many use cases.
• Family-level system features: ECP5 architecture elements (clocking PLLs, DDR support, DSP slice concepts, SERDES and on-chip oscillator) provide architectural flexibility for diverse system functions.
• Compact surface-mount package: 554-CABGA (23 × 23 mm) balances board space and thermal/assembly compatibility for modern PCB designs.
• Compliance and commercial readiness: RoHS compliance and a defined commercial temperature range (0 °C to 85 °C) simplify procurement and manufacturing for commercial products.

Why Choose LFE5U-45F-6BG554C?

The LFE5U-45F-6BG554C positions itself where mid-range programmable logic, significant I/O and on-chip memory must coexist in a compact package. As a member of the Lattice ECP5 family, it leverages the family’s documented architectural building blocks to address a variety of board-level functions without over-specifying power or thermal needs.

This device is suited to engineers and procurement teams designing commercial products that require a balance of logic density, I/O connectivity and embedded memory with the supply-voltage and temperature specifications clearly defined for predictable integration and production planning.

Request a quote or submit a purchase inquiry to obtain pricing, lead time and availability for the LFE5U-45F-6BG554C. Our team can provide the part details you need to move from evaluation to production.