LFE5UM-45F-7BG381I

The LFE5UM-45F-7BG381I is an ECP5 family FPGA from Lattice Semiconductor, presented in a 381-CABGA (17×17) surface-mount package. This industrial-grade device integrates configurable logic, embedded memory, and a broad I/O complement to support programmable digital designs.

With approximately 44,000 logic elements, roughly 1.99 Mbits of on-chip RAM, and 203 programmable I/Os, the device targets designs that require dense logic, embedded memory, and flexible interfacing within a compact, industrial-temperature rated package.

Key Features

• Logic Capacity  Approximately 44,000 logic elements provide the configurable resources for complex digital implementations.
• Embedded Memory  Approximately 1.99 Mbits of on-chip RAM for data buffering, FIFOs, and state storage.
• I/O Count & Flexibility  203 programmable I/O pins suitable for broad interfacing needs in mixed-signal and digital systems.
• Package & Mounting  381-FBGA (381-CABGA, 17×17) surface-mount package designed for compact board integration.
• Voltage & Power  Core supply range specified from 1.045 V to 1.155 V, enabling designs with a defined low-voltage core domain.
• Operating Temperature  Industrial temperature grade with operating range from −40 °C to 100 °C for demanding environments.
• Family-Level Architecture  ECP5 family features referenced in the datasheet include clocking (PLLs), memory blocks, DSP resources, SERDES and physical coding sublayer, and programmable I/O buffers useful for diverse interface and timing requirements.
• Reliability & Testability  Datasheet highlights device configuration options and single-event upset (SEU) support as part of family-level reliability features.
• Compliance  RoHS-compliant construction for regulatory conformity in modern electronics manufacturing.

Typical Applications

• High‑speed memory interfaces  Use the ECP5 family’s DDR memory support and embedded RAM to implement memory controllers, buffering, and interface logic.
• Serial connectivity and protocol bridging  Family-level SERDES and physical coding sublayer support enable implementation of serial transceivers and protocol converters.
• DSP and signal processing  On-chip DSP-oriented resources and embedded memory facilitate real-time signal processing and algorithm acceleration.
• Industrial control and automation  Industrial-grade operating temperature and a high I/O count support sensor aggregation, motor control I/O, and machine-control logic.

Unique Advantages

• High logic and memory integration: Combines approximately 44,000 logic elements with ~1.99 Mbits of embedded RAM to consolidate logic and buffering on a single device.
• Broad I/O capability: 203 I/Os enable direct connections to peripherals, sensors, and external interfaces, reducing the need for external glue logic.
• Compact, manufacturable package: 381-CABGA (17×17) surface-mount footprint balances density and board-level integration for space-constrained designs.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Defined core voltage domain: A narrow core supply range (1.045–1.155 V) simplifies power sequencing and design planning for the core domain.
• Family-level system features: ECP5 family capabilities such as PLLs, DDR support, SERDES, and DSP slices provide a versatile architectural foundation for many embedded applications.

Why Choose LFE5UM-45F-7BG381I?

This ECP5 family device delivers a balanced combination of logic density, embedded memory, and I/O resources in a compact 381-FBGA package, with industrial temperature support and RoHS compliance. It is suitable for engineers designing systems that require on-chip memory, programmable logic, and flexible I/O in a single, surface-mount FPGA.

Choose the LFE5UM-45F-7BG381I for designs that demand scalable programmable logic, integrated memory resources, and the family-level clocking, SERDES, and DSP capabilities documented in the ECP5 datasheet. Its specifications make it a practical option for industrial embedded designs, connectivity interfaces, and signal-processing applications where compact integration and predictable electrical and thermal ranges are important.

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