LFE5UM-45F-8BG381I
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 203 1990656 44000 381-FBGA |
|---|---|
| Quantity | 29 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 203 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11000 | Number of Logic Elements/Cells | 44000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1990656 |
Overview of LFE5UM-45F-8BG381I – ECP5 Field Programmable Gate Array (FPGA)
The LFE5UM-45F-8BG381I is an ECP5-family FPGA from Lattice Semiconductor provided in a 381-FBGA package. It delivers a mid-range logic density and I/O capability with on-chip memory and architecture features described in the ECP5 data sheet.
Designed for industrial-grade applications, this device offers approximately 44,000 logic elements, roughly 1.99 Mbits of embedded memory, and 203 programmable I/O, operating over a supply range of 1.045 V to 1.155 V and an ambient temperature range of −40 °C to 100 °C.
Key Features
- Core Logic Approximately 44,000 logic elements provide a balanced fabric for mid-density programmable logic designs.
- Configurable Logic Blocks (CLBs) ECP5-family architecture detailed in the datasheet, including slice and PFU building blocks used for implementing custom logic.
- Embedded Memory Approximately 1.99 Mbits of on-chip RAM for local buffering, state machines, and small data storage.
- I/O Capacity 203 programmable I/O pins support a wide range of external interfaces and connectivity requirements.
- High-Speed Interfaces & SERDES ECP5 family documentation includes SERDES and PCS blocks and related features for serial link implementations.
- Memory Interface Support Datasheet sections for DDR memory support and calibrated DQS delay indicate built-in resources for memory interfacing.
- Clocking & DSP On-chip clocking structures, PLLs, and sysDSP slice elements are part of the ECP5 family architecture for timing and signal processing tasks.
- Package & Mounting 381-FBGA (supplier device package: 381-CABGA, 17 × 17 mm) in a surface-mount form factor.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
- Power Supply Core supply range specified from 1.045 V to 1.155 V.
- Regulatory RoHS-compliant.
Typical Applications
- High-Speed Serial Interfaces Use the device’s SERDES and PCS-capable blocks for implementing serial links and protocol bridging.
- Memory Interface Controllers Leverage the device’s DDR memory support and DQS calibration resources for external memory PHY and controller functions.
- Signal Processing and DSP Employ sysDSP slices and on-chip RAM for fixed-point processing, filtering, and real-time data handling.
- Embedded Control and I/O Aggregation 203 programmable I/O pins and logic density make the device suitable for consolidating peripheral control, sensor interfaces, and protocol conversion tasks.
Unique Advantages
- Balanced Logic Density: Approximately 44,000 logic elements provide significant programmable capacity without the footprint of larger FPGAs, enabling mid-range integration.
- On-Chip Memory: About 1.99 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
- Extensive I/O: 203 I/O pins support complex board-level connectivity and multiple interface standards using the ECP5 programmable I/O resources.
- Industrial Temperature Range: Operation from −40 °C to 100 °C supports deployment in a wide range of industrial environments.
- Compact BGA Packaging: 381-FBGA (17 × 17 mm) surface-mount package enables a compact PCB implementation while accommodating the device’s I/O and thermal needs.
- Standards and Compliance: RoHS compliance supports regulatory and environmental requirements for many commercial and industrial products.
Why Choose LFE5UM-45F-8BG381I?
The LFE5UM-45F-8BG381I delivers ECP5-family architecture and features in an industrial-grade FPGA package, combining a mid-range logic element count, substantial on-chip RAM, and a high I/O count. Its documented support for SERDES, DDR memory interfaces, clocking primitives, and DSP slices makes it a practical choice for designs requiring moderate programmable logic, embedded memory, and high-speed interface capability.
This device is suited to engineering teams seeking a compact, RoHS-compliant FPGA with an industrial operating range and the architecture resources described in the ECP5 family datasheet. It supports scalable design choices and leverages the ECP5 feature set for integration of interface, memory, and signal-processing functions.
Request a quote or submit a procurement inquiry to receive pricing and availability for the LFE5UM-45F-8BG381I. Our team can provide configuration guidance and lead-time details to support your design schedule.