LIFCL-40-7BG400I
| Part Description |
CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 192 1548288 39000 400-LFBGA |
|---|---|
| Quantity | 1,390 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 192 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9750 | Number of Logic Elements/Cells | 39000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1548288 |
Overview of LIFCL-40-7BG400I – CrossLink-NX Field Programmable Gate Array (FPGA), 192 I/O, 400-LFBGA
The LIFCL-40-7BG400I is a CrossLink-NX field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It integrates substantial programmable logic and embedded memory with a high I/O count for compact system designs.
Designed for industrial applications, this device provides up to 39,000 logic elements, approximately 1.548 Mbits of embedded memory, and 192 I/O in a 400-LFBGA surface-mount package, operating from 0.95 V to 1.05 V and across a −40 °C to 100 °C temperature range.
Key Features
- Core Logic Provides 39,000 logic elements suitable for implementing combinational and sequential logic, glue logic, and custom accelerators.
- On-Chip Memory Approximately 1.548 Mbits of embedded RAM to support buffering, FIFOs, and small data structures without external memory.
- I/O Density 192 I/O pins to support parallel interfaces, multiple serial links, and mixed-signal front-end connections.
- Power Single-core voltage supply range from 0.95 V to 1.05 V for digital core operation.
- Package & Mounting 400-LFBGA (supplier device package: 400-CABGA 17×17) in a surface-mount BGA footprint for compact, board-level integration.
- Temperature & Grade Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
- Regulatory Compliance RoHS compliant to align with environmental requirements for lead-free assembly.
Typical Applications
- Industrial Control Motor control, PLC interface logic, and factory automation systems benefiting from a high I/O count and industrial temperature rating.
- Video and Image Processing On-chip memory and logic resources for buffering, pixel formatting, and custom pre-processing pipelines.
- Communications & Interface Bridging Protocol bridging, parallel/serial interface aggregation, and I/O translation using abundant I/O and logic capacity.
- Sensor Aggregation Multi-sensor hubs and edge data preprocessing where local buffering and configurable logic reduce latency.
Unique Advantages
- High Logic Capacity: 39,000 logic elements enable implementation of complex, custom logic functions without immediate need for additional FPGAs.
- Embedded Memory Onboard: Approximately 1.548 Mbits of RAM reduces dependence on external memory for buffering and small-data storage.
- Large I/O Complement: 192 I/O pins provide flexibility to connect multiple peripherals, sensors, and high-bandwidth interfaces directly.
- Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in harsh or wide-temperature environments.
- Compact BGA Package: 400-LFBGA (400-CABGA 17×17) allows dense board layouts and a small PCB footprint for space-constrained designs.
- RoHS Compliance: Meets lead-free manufacturing requirements for modern electronics assembly.
Why Choose LIFCL-40-7BG400I?
The LIFCL-40-7BG400I delivers a balanced combination of logic density, embedded memory, and I/O capability in a compact industrial-grade BGA package. Its specifications—39,000 logic elements, roughly 1.548 Mbits of on-chip RAM, 192 I/O, and a −40 °C to 100 °C operating range—make it well suited for industrial controls, interface bridging, and embedded processing tasks where board space and temperature robustness matter.
Backed by Lattice Semiconductor Corporation, this FPGA option is intended for engineers and buyers seeking a scalable, compact programmable logic device that integrates substantial logic and memory resources while conforming to RoHS manufacturing requirements.
If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and ordering information.