M2GL010T-FG484

IC FPGA 233 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 233 933888 12084 484-BGA

Quantity 1,412 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O233Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12084Number of Logic Elements/Cells12084
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits933888

Overview of M2GL010T-FG484 – IGLOO2 FPGA, 12,084 logic elements, 233 I/O, 484‑BGA

The M2GL010T-FG484 is an IGLOO2 flash-based Field Programmable Gate Array from Microchip Technology. Built on the IGLOO2 architecture, it combines low-power flash FPGA fabric with high-performance communications and memory interfaces to address embedded systems, communications, and DSP-oriented designs.

With 12,084 logic elements, approximately 0.9 Mbits of embedded RAM, and 233 user I/Os in a compact 484‑BGA (23×23) package, this device targets designs that require dense logic, substantial on-chip memory, and flexible I/O in a commercial-temperature-rated device.

Key Features

  • Flash-based FPGA fabric — IGLOO2 architecture integrates fourth‑generation flash configuration for nonvolatile programmability and low static power.
  • Logic capacity — 12,084 logic elements to implement control, glue logic, and mid-density programmable functions.
  • On-chip memory — Total of 933,888 bits (approximately 0.9 Mbits) of embedded RAM for buffering, state storage, and small data structures.
  • High I/O count — 233 user I/Os supporting multiple voltage standards to interface with sensors, peripherals, and high‑speed PHYs.
  • High‑performance communications (series capabilities) — IGLOO2 series supports high‑speed SERDES lanes, XAUI/XGMII extensions, native SERDES, and PCIe endpoint cores for system-level connectivity.
  • Memory controller support (series capabilities) — DDRx memory controller options in the IGLOO2 family support LPDDR/DDR2/DDR3 operation and high‑speed external DRAM interfaces.
  • DSP and math resources (series capabilities) — Embedded mathblocks and multiplier/accumulator resources in the IGLOO2 architecture enable digital signal processing tasks.
  • Clocking resources (series capabilities) — Multiple clock sources and up to eight Clock Conditioning Circuits (CCCs) with integrated PLLs for flexible clocking and phase control.
  • Security features (series capabilities) — Design and data security capabilities include encrypted bitstream loading, device certificate models, and optional cryptographic services in premium devices.
  • Package and mounting — 484‑BGA (23×23) surface‑mount package optimized for compact board integration.
  • Electrical and environmental — Supply voltage range 1.14 V to 2.625 V and commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • High‑speed communications — Implement PHY interfaces, PCIe endpoints, and SERDES‑based links using the IGLOO2 communication features in applications such as network appliances and embedded switches.
  • Embedded control and interface — Use the device’s 233 I/Os and programmable logic to consolidate sensor interfaces, board control, and protocol bridging in embedded systems.
  • Signal processing and DSP — Leverage on‑chip RAM and mathblocks for filtering, accumulation, and other mid‑range DSP tasks in instrumentation and industrial electronics.
  • Memory buffering and controller offload — Employ the IGLOO2 memory interfaces and on‑chip RAM to implement data buffering, DDR bridge functions, and memory controller support.

Unique Advantages

  • Low‑power, nonvolatile fabric: Flash‑based configuration reduces static power and preserves configuration without external storage.
  • Balanced logic and memory: 12,084 logic elements paired with approximately 0.9 Mbits of embedded RAM supports complex control and moderate data buffering on‑chip.
  • High I/O density in a compact package: 233 user I/Os in a 484‑BGA (23×23) enable rich external connectivity while conserving PCB area.
  • Scalable communications options: Series-level SERDES and PCIe support facilitate integration into networked and high‑throughput system architectures.
  • Security and reliability features: IGLOO2 series security mechanisms (encrypted bitstreams, device certificates, anti‑tamper features) help protect IP and supply‑chain integrity.
  • Commercial temperature rating and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for general commercial applications and standard manufacturing practices.

Why Choose M2GL010T-FG484?

The M2GL010T-FG484 delivers a practical combination of programmable logic density, embedded memory, and flexible I/O in a compact 484‑BGA package. It is suited for designers who need mid‑density FPGA resources with on‑chip RAM and a variety of communication and memory interface options provided by the IGLOO2 architecture.

Its flash‑based configuration, security features, and series‑level support for high‑speed interfaces and memory controllers make it a solid choice for embedded systems, communications equipment, and DSP‑oriented designs where low static power, on‑board nonvolatile configuration, and reliable operation across commercial temperature ranges are required.

Request a quote or submit an inquiry for the M2GL010T-FG484 to receive pricing and availability details or to discuss your application requirements with our team.

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