OR2T04A4T100-DB

FPGA, 100 CLBS, 4800 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 160 6400 400 100-LQFP

Quantity 1,532 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-LQFPNumber of I/O160Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs100Number of Logic Elements/Cells400
Number of Gates11000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits6400

Overview of OR2T04A4T100-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC 160 I/O, 6.4 kb RAM, 400 Logic Elements, 100-LQFP

The OR2T04A4T100-DB is an ORCA™2 Field Programmable Gate Array (FPGA) IC in a 100-lead LQFP package designed for commercial-grade applications. It combines programmable logic with on-chip RAM and a broad I/O complement to implement custom digital functions, glue logic, and I/O interfacing within a 3.0–3.6 V supply range and a 0 °C to 70 °C operating temperature.

Key Features

  • Programmable Logic  Approximately 400 logic elements provide the core configurable resources for implementing custom combinational and sequential logic.
  • Logic Blocks  100 logic blocks (CLBs) available for partitioning designs across multiple functional units.
  • Embedded Memory  Approximately 6,400 bits of on-chip RAM to support small buffers, state storage, and table-based logic.
  • I/O Capacity  160 general-purpose I/O pins to support interfacing with sensors, peripherals, and external devices.
  • Gate Equivalent  11,000 gates of logic density for mid-range programmable tasks and control functions.
  • Power and Thermal  Operates from a 3.0 V to 3.6 V supply with a commercial operating temperature range of 0 °C to 70 °C.
  • Package and Mounting  Surface-mount 100-LQFP package (supplier device package: 100-TQFP 14×14) for standard PCB assembly flows.
  • Compliance  RoHS-compliant for environmental and regulatory compatibility in commercial products.

Typical Applications

  • Commercial Embedded Systems  Implement control and interface logic where a compact FPGA with moderate logic and RAM meets design requirements within a commercial temperature range.
  • Peripheral and I/O Bridging  Use the 160 I/O pins and programmable logic to implement protocol bridging, I/O expansion, and custom signal conditioning.
  • Prototyping and Development  A 100-lead LQFP package and accessible logic capacity make this device suitable for board-level prototyping and validation of digital functions.

Unique Advantages

  • Balanced Logic and Memory:  Approximately 400 logic elements and 6,400 bits of on-chip RAM provide a balanced resource mix for small-to-medium digital designs without external memory.
  • High I/O Density:  160 I/O pins allow direct interfacing to multiple peripherals and sensors, reducing external glue logic and connector requirements.
  • Standard Power Envelope:  Support for a 3.0–3.6 V supply simplifies integration into common commercial power domains.
  • Compact, Surface-Mount Packaging:  The 100-LQFP (14×14) surface-mount package supports conventional PCB assembly and helps minimize board area.
  • Regulatory Compatibility:  RoHS compliance supports use in products that require lead-free assembly and environmental regulatory adherence.

Why Choose OR2T04A4T100-DB?

The OR2T04A4T100-DB positions itself as a commercially graded, mid-density FPGA solution that delivers a practical mix of logic, embedded RAM, and extensive I/O in a compact 100-LQFP package. Its 3.0–3.6 V supply range and 0 °C to 70 °C operating window align with a wide range of commercial electronic products where space-efficient programmable logic is needed.

This device is well suited for designers and procurement teams seeking a compact, RoHS-compliant FPGA for prototyping, I/O interfacing, and control logic integration. The combination of logic elements, on-chip RAM, and abundant I/O helps reduce external components and simplifies board-level design choices.

Request a quote or submit an inquiry to obtain pricing and availability for the OR2T04A4T100-DB. Our team can provide lead-time information and support for your procurement needs.

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