OR2T10A5BA256-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 209 16384 1024 256-BGA |
|---|---|
| Quantity | 86 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 209 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 256 | Number of Logic Elements/Cells | 1024 | ||
| Number of Gates | 28300 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 16384 |
Overview of OR2T10A5BA256-DB – ORCA™2 Field Programmable Gate Array, 209 I/O, 256-BGA
The OR2T10A5BA256-DB is an ORCA™2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a compact, commercial-grade FPGA solution with a balanced set of logic, memory and I/O resources for embedded and consumer electronics designs.
Key on-chip resources include 1,024 logic elements, 16,384 bits of total RAM, and 209 I/O pins in a 256-BGA (256-PBGA, 27×27) surface-mount package. The device operates from a 3.0 V to 3.6 V supply and is specified for commercial ambient temperatures (0 °C to 70 °C).
Key Features
- Core Logic 1,024 logic elements providing approximately 28,300 gates for implementing combinational and sequential logic.
- Embedded Memory 16,384 bits of on-chip RAM (approximately 16 kbits) for buffering, small FIFOs or state storage.
- I/O Density 209 user I/O pins to support multiple peripherals, GPIOs and parallel interfaces.
- Package 256-BGA package (supplier device package: 256-PBGA, 27×27) in a surface-mount mounting style for compact board layouts.
- Power Operates from a 3.0 V to 3.6 V supply range common to commercial power rails.
- Temperature & Grade Commercial grade device specified for 0 °C to 70 °C operation.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded control and glue logic Use the device's 1,024 logic elements and 209 I/O pins to implement glue logic, protocol conversion and control tasks in compact systems.
- User interface control Drive and manage buttons, indicators and simple display interfaces using the high I/O count and on-chip logic.
- Sensor interfacing and data buffering Aggregate sensor inputs and perform lightweight preprocessing with available logic and 16,384 bits of on-chip RAM for temporary storage.
- I/O expansion for commercial electronics Add programmable I/O and custom peripheral support in consumer and commercial devices while maintaining a small PCB footprint.
Unique Advantages
- High I/O in a compact footprint: 209 I/O pins in a 256-BGA package provide significant connectivity without a large board area.
- Balanced logic and memory: 1,024 logic elements paired with ~16 kbits of RAM enable mid-range logic functions with on-chip buffering.
- Surface-mount BGA packaging: The 256-PBGA (27×27) package supports dense routing and modern assembly processes.
- Commercial power compatibility: 3.0 V to 3.6 V supply range aligns with common commercial power rails, simplifying power-system design.
- RoHS compliant: Meets standard environmental requirements for lead-free assembly.
- Commercial temperature rating: Specified 0 °C to 70 °C operation for typical commercial electronics deployments.
Why Choose OR2T10A5BA256-DB?
The OR2T10A5BA256-DB provides a practical, commercially graded FPGA option for designs that require a mix of moderate logic capacity, on-chip memory and a high count of I/O in a compact BGA footprint. Its combination of 1,024 logic elements, 16,384 bits of RAM and 209 I/O pins makes it well suited to embedded control, I/O expansion and interface consolidation tasks in consumer and commercial applications.
Designed and manufactured by Lattice Semiconductor Corporation and offered in a RoHS-compliant 256-BGA package, this device delivers predictable supply and temperature requirements (3.0 V–3.6 V, 0 °C–70 °C) for reliable integration into production designs.
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