AS4C16M16SB-6BINTR

IC DRAM 256MBIT LVTTL 54TFBGA
Part Description

IC DRAM 256MBIT LVTTL 54TFBGA

Quantity 1,243 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of AS4C16M16SB-6BINTR - 256Mbit LVTTL SDRAM in 54-TFBGA Package

The AS4C16M16SB-6BINTR from Alliance Memory is a 256Mbit synchronous dynamic RAM (SDRAM) organized as 16M x 16, delivering reliable memory performance for embedded systems and industrial applications. With LVTTL-compatible signaling and a compact 54-pin TFBGA package, this DRAM chip provides a balance of capacity, speed, and board space efficiency for designs requiring cost-effective volatile memory solutions.

Key Features

  • Memory Core - 256Mbit SDRAM with 16M x 16 organization, providing flexible word-based addressing for processor interfaces and data buffering applications.
  • Interface and Speed - LVTTL-compatible interface operates at 166MHz clock frequency with 5ns access time, supporting fast read/write cycles for real-time data processing.
  • Power Requirements - 3V to 3.6V supply voltage range enables compatibility with standard 3.3V logic systems while maintaining low power consumption.
  • Package and Form Factor - 54-TFBGA package in an 8x8mm footprint delivers high pin density and minimal PCB area usage compared to traditional TSOP packages.
  • Temperature Range - Industrial-grade -40°C to 85°C (TA) operating temperature supports deployment in harsh environments and temperature-variable applications.
  • Write Performance - 12ns write cycle time enables rapid data updates for buffering, caching, and temporary storage tasks.

Typical Applications

  • Industrial Controllers - This SDRAM serves as working memory for PLCs, motion controllers, and industrial PCs where the extended temperature range ensures reliable operation in factory floor conditions and the LVTTL interface integrates seamlessly with common industrial processors.
  • Networking Equipment - The 256Mbit capacity and fast access times make this device suitable for packet buffering and routing table storage in switches, routers, and network appliances where data throughput and low latency are critical.
  • Embedded Systems - The compact TFBGA package enables high memory density in space-constrained embedded designs such as handheld terminals, medical devices, and point-of-sale systems where board real estate is at a premium.
  • Test and Measurement Instruments - The fast write cycle time and synchronous operation support high-speed data acquisition and waveform capture applications where temporary storage of measurement data is required before processing or transmission.
  • Automotive Infotainment - With industrial temperature tolerance and stable 3.3V operation, this SDRAM can support non-safety-critical automotive applications like dashboard displays and entertainment systems where cost-effective memory solutions are needed.

Unique Advantages

  • Space-Efficient Memory Solution: The 54-TFBGA package reduces PCB footprint by approximately 60% compared to equivalent TSOP packages, enabling smaller product designs or freeing board space for additional functionality.
  • Simplified Power Design: Single 3V to 3.6V supply eliminates the need for multiple voltage rails, reducing BOM costs and power management complexity in 3.3V logic systems.
  • Extended Lifecycle Support: Alliance Memory's focus on long-term availability helps mitigate obsolescence risks for industrial and embedded applications with multi-year production lifecycles.
  • Standard LVTTL Interface: Direct compatibility with LVTTL logic levels removes the need for level-shifting circuitry when interfacing with common microcontrollers and processors, simplifying design and reducing component count.
  • Industrial Temperature Reliability: Tested and characterized for -40°C to 85°C operation ensures consistent performance across extreme temperature variations encountered in outdoor, automotive, and industrial environments.
  • Cost-Effective Memory Expansion: SDRAM technology offers a lower-cost alternative to SRAM for applications where refresh overhead is acceptable, enabling higher density memory solutions within budget constraints.

Why Choose AS4C16M16SB-6BINTR?

The AS4C16M16SB-6BINTR addresses the needs of embedded and industrial designers seeking reliable, cost-effective volatile memory with industrial temperature ratings and a space-saving package. Alliance Memory's commitment to long-term product availability makes this component particularly suitable for industrial equipment, automation systems, and other applications where extended product lifecycles are important. The combination of standard LVTTL interfacing, compact TFBGA packaging, and wide temperature tolerance delivers practical advantages for designs operating in challenging environments.

This SDRAM is an ideal choice for system architects balancing memory performance, board space, and total system cost in industrial, networking, and embedded computing applications where proven SDRAM technology meets modern packaging and reliability requirements.

Request a Quote

Contact our sales team to discuss pricing, lead times, and volume availability for the AS4C16M16SB-6BINTR. Our technical support staff can also assist with integration questions, reference designs, and application-specific recommendations to help you get the most from this memory solution in your next project.

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