AS4C16M16SA-7TCN

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 695 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C16M16SA-7TCN – 256 Mbit SDRAM, 54‑TSOP II

The AS4C16M16SA-7TCN is a 256 Mbit volatile SDRAM organized as 16M × 16 with a parallel memory interface. It provides a 143 MHz clock frequency and a 5.4 ns access time for synchronous DRAM operations.

Offered in a 54‑lead TSOP II (0.400", 10.16 mm width) package and specified for 3.0 V to 3.6 V operation and 0 °C to 70 °C ambient temperature, this device is sized for designs requiring mid‑density parallel SDRAM in a compact TSOP footprint.

Key Features

  • Core / Memory Organization  256 Mbit SDRAM organized as 16M × 16, providing a parallel data path for synchronous DRAM access.
  • Performance  Clock frequency: 143 MHz and access time of 5.4 ns to support synchronous read/write timing requirements.
  • Timing  Write cycle time (word/page): 14 ns, enabling predictable write timing in parallel memory systems.
  • Power  Supply voltage range 3.0 V to 3.6 V to match typical 3.3 V system rails.
  • Package  54‑lead TSOP II (0.400", 10.16 mm width) surface‑mount package suitable for compact board layouts.
  • Operating Conditions  Operating ambient temperature range of 0 °C to 70 °C (TA) as specified for standard commercial environments.

Typical Applications

  • Parallel memory architectures  Acts as a 256 Mbit parallel SDRAM device for systems that require a 16M × 16 organization and synchronous DRAM timing.
  • Systems with 3.0–3.6 V rails  Designed for use where the system supply falls within the specified 3.0 V to 3.6 V range.
  • Space‑constrained board designs  The 54‑TSOP II (0.400", 10.16 mm) package supports compact surface‑mount placement.
  • Commercial temperature applications  Suitable for designs operating within the 0 °C to 70 °C ambient temperature window.

Unique Advantages

  • Right‑sized capacity: 256 Mbit density organized as 16M × 16 provides a mid‑range memory option without overprovisioning board area.
  • Synchronous performance: 143 MHz clock and 5.4 ns access time deliver predictable synchronous read/write timing for parallel memory systems.
  • Compact TSOP II packaging: 54‑lead TSOP II (0.400", 10.16 mm) enables higher memory density on space‑limited PCBs.
  • Standard voltage compatibility: 3.0 V to 3.6 V supply range aligns with common 3.3 V system rails for straightforward integration.
  • Deterministic write timing: 14 ns write cycle time (word/page) supports consistent write operation planning in system timing budgets.

Why Choose AS4C16M16SA-7TCN?

The AS4C16M16SA-7TCN positions itself as a practical 256 Mbit parallel SDRAM option combining synchronous access performance with a compact 54‑TSOP II package. Its 16M × 16 organization, 143 MHz clocking and 5.4 ns access time provide clear, verifiable performance parameters for systems that require predictable SDRAM behavior.

This device is suited to designs that need a mid‑density SDRAM with standard 3.0–3.6 V operation and commercial temperature range, offering a balance of capacity, timing, and package compactness for engineers optimizing board area and memory performance.

Request a quote or contact sales to discuss pricing, availability, and lead times for the AS4C16M16SA-7TCN.

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