AS4C16M16SA-7TCN
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 695 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of AS4C16M16SA-7TCN – 256 Mbit SDRAM, 54‑TSOP II
The AS4C16M16SA-7TCN is a 256 Mbit volatile SDRAM organized as 16M × 16 with a parallel memory interface. It provides a 143 MHz clock frequency and a 5.4 ns access time for synchronous DRAM operations.
Offered in a 54‑lead TSOP II (0.400", 10.16 mm width) package and specified for 3.0 V to 3.6 V operation and 0 °C to 70 °C ambient temperature, this device is sized for designs requiring mid‑density parallel SDRAM in a compact TSOP footprint.
Key Features
- Core / Memory Organization 256 Mbit SDRAM organized as 16M × 16, providing a parallel data path for synchronous DRAM access.
- Performance Clock frequency: 143 MHz and access time of 5.4 ns to support synchronous read/write timing requirements.
- Timing Write cycle time (word/page): 14 ns, enabling predictable write timing in parallel memory systems.
- Power Supply voltage range 3.0 V to 3.6 V to match typical 3.3 V system rails.
- Package 54‑lead TSOP II (0.400", 10.16 mm width) surface‑mount package suitable for compact board layouts.
- Operating Conditions Operating ambient temperature range of 0 °C to 70 °C (TA) as specified for standard commercial environments.
Typical Applications
- Parallel memory architectures Acts as a 256 Mbit parallel SDRAM device for systems that require a 16M × 16 organization and synchronous DRAM timing.
- Systems with 3.0–3.6 V rails Designed for use where the system supply falls within the specified 3.0 V to 3.6 V range.
- Space‑constrained board designs The 54‑TSOP II (0.400", 10.16 mm) package supports compact surface‑mount placement.
- Commercial temperature applications Suitable for designs operating within the 0 °C to 70 °C ambient temperature window.
Unique Advantages
- Right‑sized capacity: 256 Mbit density organized as 16M × 16 provides a mid‑range memory option without overprovisioning board area.
- Synchronous performance: 143 MHz clock and 5.4 ns access time deliver predictable synchronous read/write timing for parallel memory systems.
- Compact TSOP II packaging: 54‑lead TSOP II (0.400", 10.16 mm) enables higher memory density on space‑limited PCBs.
- Standard voltage compatibility: 3.0 V to 3.6 V supply range aligns with common 3.3 V system rails for straightforward integration.
- Deterministic write timing: 14 ns write cycle time (word/page) supports consistent write operation planning in system timing budgets.
Why Choose AS4C16M16SA-7TCN?
The AS4C16M16SA-7TCN positions itself as a practical 256 Mbit parallel SDRAM option combining synchronous access performance with a compact 54‑TSOP II package. Its 16M × 16 organization, 143 MHz clocking and 5.4 ns access time provide clear, verifiable performance parameters for systems that require predictable SDRAM behavior.
This device is suited to designs that need a mid‑density SDRAM with standard 3.0–3.6 V operation and commercial temperature range, offering a balance of capacity, timing, and package compactness for engineers optimizing board area and memory performance.
Request a quote or contact sales to discuss pricing, availability, and lead times for the AS4C16M16SA-7TCN.