AS4C16M16SA-7BCN

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 1,070 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C16M16SA-7BCN – IC DRAM 256MBIT PAR 54TFBGA

The AS4C16M16SA-7BCN is a 256 Mbit volatile DRAM device implemented in SDRAM architecture with a parallel memory interface. It is organized as 16M × 16 bits and supplied in a 54‑TFBGA (8×8) package.

This device targets designs that require a moderate-density parallel SDRAM solution with defined electrical and timing characteristics: a clock frequency up to 143 MHz, 5.4 ns access time, and a write cycle time of 14 ns, operating from 3.0 V to 3.6 V and across an ambient temperature range of 0 °C to 70 °C.

Key Features

  • Memory Type & Technology Volatile SDRAM architecture providing standard DRAM behavior for temporary data storage.
  • Organization & Density 16M × 16 organization yielding a total memory size of 256 Mbit.
  • Interface Parallel memory interface suitable for parallel DRAM subsystem designs.
  • Performance Clock frequency up to 143 MHz with a listed access time of 5.4 ns and a write cycle time (word page) of 14 ns.
  • Power Operating voltage range from 3.0 V to 3.6 V.
  • Package 54‑TFBGA package (8×8) providing a compact ball grid array footprint.
  • Operating Conditions Specified ambient operating temperature range of 0 °C to 70 °C.

Typical Applications

  • Parallel memory subsystems Use as a 256 Mbit parallel SDRAM device in boards and modules that require 16M × 16 memory organization.
  • External DRAM for processors Provides temporary data storage for processors and controllers that interface with parallel SDRAM.
  • Compact board-level designs The 54‑TFBGA (8×8) package supports space-constrained PCB layouts needing moderate-density volatile memory.

Unique Advantages

  • 256 Mbit density in a compact package: 16M × 16 organization in a 54‑TFBGA (8×8) package balances capacity with board space efficiency.
  • Deterministic timing data: Specified 5.4 ns access time and 14 ns write cycle time enable predictable performance analysis.
  • Defined clock capability: Rated for operation up to 143 MHz to support designs targeting that operating frequency.
  • Standard SDRAM technology: Uses SDRAM architecture for conventional volatile memory behavior and system integration.
  • Wide supply tolerance: 3.0 V to 3.6 V supply range accommodates standard 3 V power domains.
  • Specified operating range: 0 °C to 70 °C ambient rating for applications within this temperature envelope.

Why Choose AS4C16M16SA-7BCN?

The AS4C16M16SA-7BCN provides a straightforward, specification-driven SDRAM option for designs requiring 256 Mbit of parallel volatile memory in a 16M × 16 organization. Its documented timing (5.4 ns access, 14 ns write cycle) and clock rating (143 MHz) allow engineers to plan memory subsystem performance precisely.

This device is suited for board- and module-level implementations that need a compact 54‑TFBGA package and standard 3.0–3.6 V operation across a 0 °C to 70 °C ambient range, offering a clear set of electrical and mechanical parameters for integration and qualification.

Request a quote or contact sales to discuss pricing, availability, and lead times for AS4C16M16SA-7BCN.

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