AS4C2M32D1A-5BINTR

IC DRAM 64MBIT PARALLEL 144LFBGA
Part Description

IC DRAM 64MBIT PARALLEL 144LFBGA

Quantity 1,235 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-LFBGA (12x12)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size64 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging144-LFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C2M32D1A-5BINTR - 64Mbit DDR SDRAM with Extended Industrial Temperature Range

The AS4C2M32D1A-5BINTR from Alliance Memory is a 64-megabit DDR SDRAM designed for embedded applications requiring fast, synchronous memory with industrial-grade reliability. Organized as 2M x 32, this parallel interface DRAM operates at 200MHz with a 7ns access time, delivering the performance needed for data-intensive real-time systems. With an extended operating temperature range of -40°C to 85°C, it's engineered for industrial environments where ambient conditions vary beyond commercial standards.

Key Features

  • Memory Architecture - 64-megabit capacity organized as 2M x 32, providing flexible memory mapping for 32-bit data bus systems.
  • DDR SDRAM Technology - Double data rate synchronous dynamic RAM transfers data on both clock edges, maximizing bandwidth efficiency at 200MHz clock frequency.
  • Access Performance - 7ns access time with 15ns write cycle time supports real-time processing requirements in embedded controllers and communication systems.
  • Power Supply - Single 2.3V to 2.7V supply voltage reduces power consumption and simplifies power management in battery-operated and energy-conscious designs.
  • Industrial Temperature Range - Qualified for -40°C to 85°C operation, ensuring reliable memory function in harsh industrial, transportation, and outdoor equipment installations.
  • Package - 144-pin LFBGA (12mm x 12mm) low-profile ball grid array minimizes PCB footprint while providing robust electrical connections for high-speed signal integrity.

Typical Applications

  • Industrial Automation - Provides working memory for programmable logic controllers (PLCs), motion controllers, and human-machine interfaces where extended temperature tolerance ensures consistent operation in factory floor and process control environments.
  • Networking Equipment - Serves as packet buffer memory in routers, switches, and industrial Ethernet devices operating in telecommunications closets and outdoor enclosures subject to temperature extremes.
  • Medical Instrumentation - Supports data acquisition and processing in diagnostic equipment, patient monitoring systems, and portable medical devices where reliability across varying environmental conditions is critical.
  • Transportation Systems - Functions as system memory in vehicle infotainment, telematics, and railway signaling systems exposed to wide temperature swings during operation and storage.
  • Test and Measurement - Enables high-speed data capture and waveform storage in oscilloscopes, spectrum analyzers, and automated test equipment requiring fast memory access with industrial-grade reliability.

Unique Advantages

  • Extended Temperature Qualification: Industrial -40°C to 85°C rating eliminates the need for thermal management solutions in variable-temperature environments, reducing system complexity and cost.
  • Standard DDR Interface: Pin-compatible with industry-standard DDR SDRAM controllers simplifies design migration and leverages existing firmware and hardware platforms without interface redesign.
  • Active Lifecycle Status: Ongoing production availability from Alliance Memory provides supply chain stability for long-lifecycle industrial and embedded product development.
  • Parallel Interface Efficiency: Direct parallel data bus connection reduces latency compared to serial memory interfaces, optimizing performance in real-time control and data acquisition systems.
  • Low-Profile BGA Package: 12mm x 12mm footprint with 144-ball LFBGA configuration maximizes board space efficiency while maintaining excellent thermal dissipation characteristics for industrial applications.
  • Voltage Flexibility: 2.3V to 2.7V supply range accommodates both legacy 2.5V systems and newer low-power designs, enabling use across multiple platform generations.

Why Choose AS4C2M32D1A-5BINTR?

The AS4C2M32D1A-5BINTR addresses the specific requirements of industrial and embedded system designers who need reliable, fast memory that performs consistently across extended temperature ranges. Alliance Memory's focus on industrial-grade components ensures this DDR SDRAM meets the longevity and environmental demands of applications deployed in challenging conditions, from factory automation to transportation infrastructure.

For design teams building products with multi-year deployment cycles, this memory IC offers the combination of proven DDR technology, industrial qualification, and supply continuity that reduces long-term risk while delivering the performance needed for data-intensive embedded applications.

Contact Our Team

Request a quote for the AS4C2M32D1A-5BINTR or contact our sales team to discuss volume pricing, lead times, and technical support for your industrial memory requirements. Our application engineers can assist with design integration, thermal analysis, and compatibility verification for your specific embedded system architecture.

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