AS4C32M16SB-7TCN

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 1,790 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16SB-7TCN - 512Mbit SDRAM with 143MHz Clock Speed

The AS4C32M16SB-7TCN is a 512Mbit synchronous DRAM (SDRAM) from Alliance Memory, organized as 32M x 16 bits. This parallel-interface memory device delivers 143MHz clock frequency operation with 5.4ns access time, making it suitable for embedded systems and computing applications requiring reliable high-speed memory.

Operating from a 3V to 3.6V supply voltage and housed in a 54-pin TSOP II package, this SDRAM provides a proven memory solution for designs requiring commercial temperature range operation.

Key Features

  • High-Density Memory Architecture - 512Mbit capacity organized as 32M x 16 provides substantial memory depth for data buffering, frame storage, and system memory applications.
  • Fast Synchronous Operation - 143MHz clock frequency with 5.4ns access time enables efficient data throughput synchronized to system clocks.
  • Standard Voltage Operation - 3V to 3.6V supply voltage range ensures compatibility with common embedded power rails while supporting reliable operation across varying supply conditions.
  • Industry-Standard Package - 54-TSOP II package (0.400", 10.16mm width) offers a proven footprint for straightforward PCB layout and compatibility with existing designs.
  • Commercial Temperature Range - Specified operation from 0°C to 70°C supports typical indoor and controlled-environment applications.
  • Parallel Memory Interface - Standard parallel interface provides direct connection to processors and controllers without specialized interface circuitry.

Typical Applications

  • Embedded Computing Systems - This SDRAM serves as main system memory or data buffer in embedded processors where 512Mbit capacity supports operating systems, application code, and runtime data storage.
  • Networking Equipment - Routers, switches, and network appliances utilize this memory for packet buffering and routing table storage where fast access times support throughput requirements.
  • Consumer Electronics - Set-top boxes, digital media players, and smart displays benefit from the combination of memory density and standard interface for video buffering and application execution.
  • Office Automation Equipment - Printers, copiers, and multifunction devices use this SDRAM for image processing buffers and firmware execution memory.

Unique Advantages

  • Drop-in Compatibility: 54-TSOP II package and standard SDRAM interface allow direct replacement in existing designs without PCB modifications.
  • Simplified Power Design: Single 3.3V nominal supply reduces power rail complexity compared to multi-voltage memory solutions.
  • Proven Technology: SDRAM architecture provides mature, well-characterized performance with extensive software and controller support.
  • Active Product Status: Current production status ensures availability for new designs and ongoing manufacturing requirements.
  • 14ns Write Cycle Time: Fast write operations support efficient data transfers in write-intensive applications.

Why Choose AS4C32M16SB-7TCN?

The AS4C32M16SB-7TCN offers a reliable 512Mbit SDRAM solution for designers seeking proven memory technology with straightforward integration. Its 143MHz operation and 5.4ns access time deliver the performance needed for embedded computing while the industry-standard TSOP II package simplifies design-in and manufacturing.

This device is well-suited for cost-effective embedded systems, networking equipment, and consumer electronics where commercial temperature range operation meets application requirements. Alliance Memory's active production status provides confidence in long-term supply availability.

Call to Action

Contact our sales team to request a quote for the AS4C32M16SB-7TCN or to discuss your SDRAM memory requirements. Technical documentation and samples are available to support your evaluation process.

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