AS4C32M8D1-5TCN

IC DRAM 256MBIT PAR 66TSOP II
Part Description

IC DRAM 256MBIT PAR 66TSOP II

Quantity 463 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C32M8D1-5TCN - 256Mbit DDR1 SDRAM

The AS4C32M8D1-5TCN is a 256-megabit DDR1 SDRAM memory device organized as 32M x 8 bits. Built on proven SDRAM technology, this parallel interface memory component delivers reliable data storage and retrieval for embedded systems requiring moderate memory capacity at 200MHz clock frequency. With a 2.5V nominal supply voltage and commercial temperature range operation, it provides cost-effective memory solutions for industrial and commercial applications.

Key Features

  • Core Memory Architecture - 256Mbit total capacity organized as 32M x 8, providing flexible byte-wide data access for embedded processor and controller applications.
  • DDR1 SDRAM Technology - Double Data Rate synchronous DRAM transfers data on both rising and falling clock edges at 200MHz, doubling effective bandwidth compared to conventional SDRAM.
  • Fast Access Performance - 0.7ns access time and 15ns write cycle time ensure responsive memory operations for real-time embedded applications.
  • Power Supply - Operates from 2.3V to 2.7V supply voltage, compatible with standard 2.5V logic families and reducing overall system power consumption.
  • Commercial Temperature Range - Rated for 0°C to 70°C ambient operation, suitable for office, commercial, and controlled industrial environments.
  • Standard Package - 66-pin TSOP II package with 10.16mm body width provides industry-standard footprint for straightforward PCB layout and sourcing.

Typical Applications

  • Embedded Computing - This DDR1 SDRAM serves as main system memory in embedded controllers and single-board computers where its 256Mbit capacity and byte-wide organization match the requirements of 8-bit and 16-bit processor architectures.
  • Network Equipment - The device provides packet buffer memory for switches and routers operating in controlled environments, where the 200MHz clock frequency supports wire-speed processing of moderate network traffic loads.
  • Office Automation - Printers, copiers, and document scanners utilize this memory for image buffering and processing tasks, benefiting from the DDR1 bandwidth for handling document data flows in commercial office settings.
  • Point-of-Sale Systems - Retail terminals and kiosks leverage this SDRAM for transaction processing and user interface operations in temperature-controlled retail environments.
  • Test and Measurement Instruments - Benchtop and portable test equipment uses this memory for data acquisition buffering and waveform storage in laboratory and field service applications within the commercial temperature range.

Unique Advantages

  • Standard DDR1 Interface: Uses industry-standard DDR1 protocol and pinout, enabling straightforward integration with established memory controller IP and reducing validation effort.
  • Byte-Wide Organization: The 32M x 8 configuration matches 8-bit and 16-bit bus architectures without requiring additional glue logic, simplifying board design.
  • Proven Technology Platform: DDR1 SDRAM represents a mature, well-understood technology with extensive design resources and support ecosystem available.
  • Cost-Effective Capacity: 256Mbit density hits the sweet spot for many embedded applications that require more than SRAM can economically provide but don't need the complexity of higher-density DDR2 or DDR3.
  • Low Voltage Operation: 2.5V nominal supply reduces power consumption compared to legacy 3.3V memories while maintaining compatibility with common embedded voltage rails.
  • Commercial Temperature Rating: Operating range of 0°C to 70°C matches the thermal environment of most commercial and office equipment, avoiding the cost premium of extended temperature variants.

Why Choose AS4C32M8D1-5TCN?

The AS4C32M8D1-5TCN addresses the memory needs of commercial embedded systems where proven DDR1 technology, moderate density, and standard interfacing are priorities. Its 256Mbit capacity and 200MHz clock frequency suit applications requiring reliable volatile storage without the complexity or power demands of newer DDR generations. The byte-wide organization and standard TSOP II package simplify board design and component sourcing.

Please note this device carries Obsolete lifecycle status. For new designs, evaluate current-generation alternatives. For legacy system support and end-of-life builds where this specific part is required, consult with your distributor regarding remaining inventory availability and extended support options.

Request a Quote

Contact our sales team for pricing, availability, and technical support for the AS4C32M8D1-5TCN. Our applications engineers can assist with integration guidance, alternative suggestions for new designs, and sourcing strategies for legacy system support.

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