AS4C4M16SA-6TINTR
| Part Description |
IC DRAM 64MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,157 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C4M16SA-6TINTR - 64Mbit Parallel SDRAM
The AS4C4M16SA-6TINTR is a 64-megabit synchronous dynamic RAM organized as 4M x 16, designed for embedded systems and computing applications requiring reliable high-speed memory. This parallel SDRAM operates at 166MHz clock frequency with 5.4ns access time, providing responsive performance for data-intensive operations in industrial and commercial environments.
Built on proven SDRAM technology and packaged in a compact 54-TSOP II format, this memory device delivers consistent operation across an extended temperature range of -40°C to 85°C, making it suitable for challenging deployment conditions beyond standard commercial specifications.
Key Features
- Memory Architecture - 64-megabit capacity organized as 4M x 16 configuration provides flexible addressing for various system designs requiring word-wide data access.
- Performance Specifications - 166MHz clock frequency with 5.4ns access time enables rapid read/write cycles for applications demanding responsive memory operations.
- Power Supply - Operates on standard 3V to 3.6V supply voltage, compatible with common embedded system power architectures.
- Parallel Interface - Traditional parallel memory interface simplifies integration with established processor and controller architectures using standard SDRAM protocols.
- Extended Temperature Range - Rated for -40°C to 85°C operation supports deployment in industrial environments where temperature extremes are expected.
- Package Format - 54-TSOP II package with 10.16mm width offers space-efficient surface-mount installation for board-level designs.
Typical Applications
- Industrial Control Systems - This SDRAM provides working memory for PLCs, motion controllers, and process automation equipment where the extended temperature range ensures reliable operation in factory floor environments.
- Embedded Computing - The 64-megabit capacity and parallel interface support embedded processors and microcontrollers in applications like point-of-sale terminals, kiosks, and industrial PCs requiring volatile working memory.
- Test and Measurement Equipment - Fast access times enable data buffering in oscilloscopes, analyzers, and diagnostic tools where temporary storage of measurement data is essential.
- Telecommunications Infrastructure - The device serves as buffer memory in routers, switches, and communication modules operating in equipment rooms with varying thermal conditions.
- Legacy System Upgrades - Parallel SDRAM architecture allows memory expansion or replacement in existing designs built around traditional memory interfaces without requiring architectural changes.
Unique Advantages
- Extended Temperature Tolerance: The -40°C to 85°C operating range reduces thermal management requirements in industrial installations where ambient conditions vary significantly.
- Standard Interface Compatibility: Parallel SDRAM protocol enables drop-in compatibility with established processor ecosystems and reduces firmware complexity compared to newer serial memory architectures.
- Proven Technology: SDRAM technology offers mature, well-documented operation characteristics that simplify design validation and long-term reliability planning.
- Space-Efficient Packaging: The 54-TSOP II surface-mount package minimizes board footprint while providing adequate pin count for parallel data and address lines.
- Active Lifecycle Status: Current production availability supports both new designs and long-term service requirements for existing products.
- Flexible Memory Organization: The 4M x 16 configuration balances capacity and data width for systems requiring word-oriented memory access patterns.
Why Choose AS4C4M16SA-6TINTR?
The AS4C4M16SA-6TINTR addresses the needs of embedded system designers requiring reliable parallel SDRAM with industrial temperature tolerance. Its combination of standard SDRAM interface, extended operating range, and active production status makes it particularly valuable for industrial control, automation, and embedded computing applications where proven technology and environmental robustness are priorities.
For designs that rely on traditional parallel memory architectures or require memory upgrades for existing systems, this device provides a straightforward solution with well-established integration paths and long-term availability.
Request a Quote
Contact our sales team for pricing, availability, and volume discounts on the AS4C4M16SA-6TINTR. Our technical support staff can also provide integration guidance and design resources to help you evaluate this memory solution for your specific application requirements.