AS4C4M32D1A-5BCNTR

IC DRAM 128MBIT PAR 144LFBGA
Part Description

IC DRAM 128MBIT PAR 144LFBGA

Quantity 893 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-LFBGA (12x12)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size128 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging144-LFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C4M32D1A-5BCNTR - 128Mbit DDR SDRAM Memory IC

The AS4C4M32D1A-5BCNTR from Alliance Memory is a 128-megabit DDR SDRAM offering high-speed parallel memory in a compact form factor. Built on proven DDR technology with a 4M x 32 organization, this device operates at 200MHz clock frequency with 7ns access time, making it ideal for applications requiring fast data throughput in commercial temperature ranges. The 144-LFBGA package provides a space-efficient solution for embedded systems and consumer electronics.

This device delivers reliable volatile memory storage with 2.5V nominal operation, balancing performance with power efficiency for cost-sensitive designs that need predictable DDR SDRAM performance.

Key Features

  • Memory Architecture - 128Mbit total capacity organized as 4M x 32, providing a 32-bit wide data bus that enables efficient parallel data transfers for processors and controllers requiring high bandwidth.
  • DDR SDRAM Technology - Double Data Rate architecture transfers data on both clock edges, effectively doubling throughput compared to standard SDRAM while maintaining compatibility with common DDR controllers.
  • Performance Specifications - 200MHz clock frequency with 7ns access time and 12ns write cycle time delivers responsive memory operations for real-time processing and buffering applications.
  • Power Supply - 2.3V to 2.7V operating voltage range with 2.5V nominal provides compatibility with standard DDR power rails and simplifies integration into existing 2.5V systems.
  • Compact Package - 144-pin LFBGA in 12x12mm footprint maximizes board space utilization while providing robust electrical connections for high-frequency signal integrity.
  • Operating Temperature - 0°C to 70°C temperature range suits commercial and consumer applications where extended industrial temperature tolerance is not required.

Typical Applications

  • Consumer Electronics - This DDR SDRAM provides working memory for set-top boxes, digital TVs, and multimedia devices where the 200MHz operation supports smooth video processing and user interface responsiveness at commercial temperature ranges.
  • Networking Equipment - The 32-bit parallel interface and 128Mbit capacity make this device suitable for packet buffering and routing table storage in switches and routers operating in controlled environments.
  • Embedded Computing - ARM and MIPS-based embedded systems benefit from the DDR interface compatibility and moderate density for running Linux or RTOS applications without over-provisioning memory capacity.
  • Industrial Control Systems - Commercial-grade industrial controllers and HMI panels operating indoors utilize this SDRAM for program execution and data logging where the 0°C to 70°C range aligns with climate-controlled facilities.
  • Printer and Imaging Systems - Document processing and raster image processing benefit from the high-speed parallel memory interface to buffer print jobs and handle graphics rendering efficiently.

Unique Advantages

  • Proven DDR Technology: Standard DDR SDRAM architecture ensures broad controller compatibility and reduces design risk with well-understood timing and interface requirements.
  • Balanced Density: 128Mbit capacity provides sufficient memory for many commercial applications without the cost premium of higher-density devices, optimizing BOM costs.
  • Single 2.5V Supply: Simplified power design with single voltage rail reduces regulator count and board complexity compared to devices requiring multiple supply voltages.
  • Space-Efficient Footprint: 12x12mm LFBGA package delivers high pin count and capacity in minimal PCB area, enabling compact product designs.
  • Active Lifecycle: Current production status provides confidence in long-term availability for designs requiring multi-year product lifespans.
  • Cost-Effective Performance: Commercial temperature range and standard DDR specification target price-sensitive applications where industrial-grade components would add unnecessary cost.

Why Choose AS4C4M32D1A-5BCNTR?

The AS4C4M32D1A-5BCNTR represents a practical choice for engineers designing commercial-grade systems that require reliable DDR SDRAM performance without over-specification. Alliance Memory's focus on memory solutions ensures this device meets standard DDR timing and electrical parameters, simplifying integration into existing designs or new platforms using common DDR controllers. The 4M x 32 organization aligns well with 32-bit processor architectures, reducing glue logic and timing complexity.

This device is particularly well-suited for consumer electronics, networking equipment, and embedded systems where the commercial temperature range aligns with operating environment requirements. The combination of 200MHz operation, compact packaging, and active lifecycle status makes it a dependable building block for products requiring moderate memory capacity with proven DDR technology.

Get Started Today

Contact our sales team to request a quote for the AS4C4M32D1A-5BCNTR or discuss volume pricing for your next design. Our technical support staff can assist with integration questions, reference designs, and application guidance to help you successfully incorporate this DDR SDRAM into your product.

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