AS4C64M4SA-7TCNTR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 463 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.5 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 4
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C64M4SA-7TCNTR - 256Mbit Parallel SDRAM Memory IC

The AS4C64M4SA-7TCNTR is a 256-megabit synchronous dynamic random access memory (SDRAM) component designed for applications requiring fast, parallel-interface volatile memory. Organized as 64M x 4 bits, this SDRAM operates at clock frequencies up to 143MHz with a 5.5ns access time, making it well-suited for industrial computing, embedded systems, and data acquisition equipment. Built in a compact 54-TSOP II package, it provides reliable performance across commercial temperature ranges from 0°C to 70°C.

Key Features

  • Memory Architecture - 256Mbit total capacity organized as 64M x 4 bits, providing flexible data width options for parallel bus designs and simplifying memory subsystem layout.
  • Performance Specifications - 143MHz clock frequency with 5.5ns access time delivers responsive data throughput for time-sensitive embedded applications and real-time control systems.
  • Power Supply - Single 3V to 3.6V operating voltage reduces power consumption and simplifies power distribution in modern digital designs.
  • Interface - Parallel memory interface offers straightforward integration with microprocessors, FPGAs, and ASICs using standard SDRAM protocols.
  • Package - 54-pin TSOP II package with 10.16mm width balances pin count with board space efficiency for moderate-density designs.
  • Operating Range - Commercial temperature range of 0°C to 70°C supports standard indoor industrial and commercial equipment installations.

Typical Applications

  • Industrial Control Systems - This SDRAM serves as working memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where the 143MHz clock speed supports responsive control loops and the commercial temperature range matches typical factory floor conditions.
  • Embedded Computing Platforms - The 256Mbit capacity and parallel interface make this component suitable for single-board computers and embedded processors running real-time operating systems that require deterministic memory access patterns.
  • Data Acquisition Equipment - Fast access times and synchronous operation enable buffering of sensor data streams in test and measurement instruments where parallel buses connect to ADCs and digital signal processors.
  • Networking Hardware - The memory supports packet buffering and routing table storage in switches and routers operating in climate-controlled environments, with the 3.3V supply matching common networking component power rails.
  • Consumer Electronics - Set-top boxes, printers, and office equipment leverage this SDRAM for graphics buffers, print spooling, and application code execution where cost-effective volatile memory is required.

Unique Advantages

  • Proven SDRAM Architecture: Standard synchronous DRAM protocol ensures broad compatibility with existing processor and controller designs, reducing development risk and accelerating time to market.
  • Simplified Power Management: Single 3.3V rail operation eliminates the need for multiple voltage regulators, reducing BOM cost and board complexity compared to older memory technologies requiring multiple supply voltages.
  • Space-Efficient Footprint: The 54-TSOP II package provides adequate pin count for the parallel interface while maintaining a compact 10.16mm width that fits standard PCB layouts without excessive real estate consumption.
  • Active Lifecycle Status: Current production availability supports ongoing manufacturing requirements and reduces end-of-life risks for products with multi-year production cycles.
  • Manufacturer Support: Alliance Memory specialization in DRAM products provides focused technical support and supply chain stability for memory-critical designs.
  • Cost-Effective Capacity: The 256Mbit density hits the sweet spot for many embedded applications that need more than basic SRAM but don't require gigabit-scale memory, optimizing both cost and board space.

Why Choose AS4C64M4SA-7TCNTR?

This SDRAM component targets designs where proven memory technology, commercial temperature operation, and parallel interfacing align with system requirements. Engineers working on industrial controllers, embedded computing modules, or data acquisition systems will find the 64M x 4 organization and 143MHz performance suitable for applications requiring moderate memory capacity with deterministic access characteristics. The component's active lifecycle status and standard TSOP II packaging support both new designs and sustaining engineering for existing products.

For projects where lower power consumption, extended temperature ranges, or higher densities are critical, alternative memory technologies may be more appropriate. However, for cost-sensitive commercial applications requiring reliable SDRAM performance in a compact parallel-interface package, the AS4C64M4SA-7TCNTR delivers solid value.

Ready to Integrate AS4C64M4SA-7TCNTR Into Your Design?

Contact our technical sales team to discuss pricing, availability, and application-specific requirements. We can provide detailed specifications, reference designs, and support for integrating this SDRAM into your next project.

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