AS4C8M32S-6TINTR

IC DRAM 256MBIT PAR 86TSOP II
Part Description

IC DRAM 256MBIT PAR 86TSOP II

Quantity 563 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C8M32S-6TINTR - 256Mbit Synchronous DRAM

The AS4C8M32S-6TINTR from Alliance Memory is a 256Mbit synchronous DRAM (SDRAM) organized as 8M x 32 bits, designed for high-performance embedded systems and computing applications. With a 166MHz clock frequency and fast 5.5ns access time, this parallel interface SDRAM delivers reliable memory performance across an industrial temperature range of -40°C to 85°C. Its voltage supply range of 3V to 3.6V makes it compatible with a wide variety of system designs.

Key Features

  • High-Density Memory Architecture - 256Mbit capacity organized as 8M x 32 bits provides substantial storage for data-intensive applications while simplifying memory controller design.
  • Fast Performance - 166MHz clock frequency with 5.5ns access time ensures rapid data retrieval and system responsiveness for real-time processing tasks.
  • Parallel Interface - Standard SDRAM parallel interface simplifies integration with existing memory controllers and reduces development complexity.
  • Industrial Temperature Range - Operates reliably from -40°C to 85°C, making it suitable for harsh environment deployments beyond commercial temperature limits.
  • Standard Voltage Operation - 3V to 3.6V supply voltage ensures compatibility with common power rails in embedded systems.
  • Compact 86-TSOP II Package - Space-efficient 86-pin TSOP II package in 10.16mm width offers high pin density while maintaining established footprint standards.

Typical Applications

  • Industrial Control Systems - This SDRAM provides working memory for PLCs, motion controllers, and factory automation equipment where the extended temperature range ensures reliable operation in manufacturing environments.
  • Embedded Computing Platforms - The 256Mbit capacity and fast access time support processor-based systems running real-time operating systems, providing sufficient memory bandwidth for multitasking applications.
  • Telecommunications Equipment - Network routers, switches, and communication infrastructure utilize this SDRAM for packet buffering and data processing, benefiting from the high clock frequency and stable operation across temperature variations.
  • Test and Measurement Instruments - Oscilloscopes, analyzers, and diagnostic equipment leverage this memory for data acquisition and waveform storage, where the parallel interface enables high-speed data capture.
  • Automotive Systems - Infotainment systems, instrument clusters, and vehicle control modules employ this industrial-temperature SDRAM for program execution and data buffering in demanding automotive environments.

Unique Advantages

  • Proven SDRAM Technology: Synchronous DRAM architecture offers predictable performance characteristics and extensive software support, reducing development risk and time-to-market.
  • Extended Temperature Operation: Industrial-grade temperature tolerance eliminates the need for environmental controls in many deployments, reducing system cost and complexity.
  • Simplified System Design: Standard parallel interface and voltage levels allow direct connection to common memory controllers without level shifters or complex timing adjustments.
  • Active Lifecycle Status: Ongoing production availability ensures long-term supply for designs requiring multi-year component sourcing.
  • Efficient Memory Organization: The 8M x 32 bit organization aligns well with 32-bit processor architectures, minimizing wasted memory cycles and improving effective bandwidth.
  • Established Package Format: Industry-standard TSOP II packaging enables automated assembly with conventional pick-and-place equipment and reflow processes.

Why Choose AS4C8M32S-6TINTR?

The AS4C8M32S-6TINTR offers a reliable memory solution for embedded systems requiring industrial-temperature operation and moderate density. Engineers designing control systems, communication equipment, or automotive electronics will appreciate the balance of capacity, speed, and environmental tolerance this SDRAM provides. The parallel interface simplifies integration with legacy designs while the industrial temperature range extends deployment options beyond commercial-grade components.

For applications demanding proven technology with predictable supply and straightforward implementation, this Alliance Memory SDRAM represents a practical choice that reduces design complexity while meeting stringent environmental requirements.

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Ready to integrate the AS4C8M32S-6TINTR into your next design? Contact our sales team to discuss pricing, lead times, and volume availability for your specific application requirements.

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