ASFC4G31MA-51BIN

4GB, EMMC 5.1, 3V, INDUSTRIAL GR
Part Description

4GB, EMMC 5.1, 3V, INDUSTRIAL GR

Quantity 768 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of ASFC4G31MA-51BIN - 4GB Industrial eMMC 5.1 Flash Memory

The ASFC4G31MA-51BIN from Alliance Memory is a 4GB embedded MultiMediaCard (eMMC) 5.1 flash memory solution designed for industrial applications. Built on MLC NAND flash technology with a 4G x 8 memory organization, this device provides reliable non-volatile storage in a compact 153-WFBGA package.

Operating across a wide industrial temperature range and featuring the eMMC 5.1 interface standard, the ASFC4G31MA-51BIN delivers robust performance for embedded systems requiring dependable data storage in demanding environments.

Key Features

  • High-Capacity Storage - 4GB (32Gbit) memory capacity in a 4G x 8 organization provides ample storage for embedded operating systems, applications, and data logging requirements.
  • eMMC 5.1 Interface - Industry-standard eMMC 5.1 interface supports clock frequencies up to 200MHz, enabling high-throughput data transfer rates for responsive system performance.
  • MLC NAND Technology - Multi-Level Cell NAND flash technology balances storage density with endurance, making it suitable for applications requiring moderate write cycles.
  • Industrial Temperature Range - Operates reliably from -40°C to 85°C, ensuring consistent performance across harsh environmental conditions found in industrial settings.
  • Flexible Voltage Supply - Wide operating voltage range of 2.7V to 3.6V accommodates various system power architectures and simplifies power supply design.
  • Compact Package - 153-FBGA package measuring 11.5mm x 13mm enables space-efficient PCB layouts while providing the pin count necessary for high-speed parallel data transfer.

Typical Applications

  • Industrial Automation Systems - The extended temperature range and reliable eMMC interface make this device well-suited for PLCs, HMIs, and factory automation equipment where consistent boot-up and data storage are critical for production uptime.
  • Embedded Computing Platforms - Single-board computers and embedded systems benefit from the 4GB capacity for storing Linux or RTOS images along with application code, while the eMMC 5.1 interface provides faster boot times than traditional SD cards.
  • Medical Device Storage - Portable and stationary medical instruments can utilize this industrial-grade memory for firmware storage and data logging, where the wide temperature tolerance ensures operation in varied clinical environments.
  • Transportation and Telematics - In-vehicle computing systems and fleet management devices leverage the industrial temperature rating for reliable operation in automotive cabin environments subject to temperature extremes.
  • Point-of-Sale Terminals - Retail and payment systems benefit from the compact form factor and reliable storage for operating system and transaction data in always-on commercial environments.

Unique Advantages

  • Simplified System Design: The integrated eMMC controller eliminates the need for external memory management, reducing component count and PCB complexity compared to raw NAND solutions.
  • Consistent Supply Chain: Alliance Memory provides long-term availability commitments for industrial customers, supporting extended product lifecycles typical of embedded applications.
  • Drop-In Compatibility: The standard 153-FBGA footprint and eMMC 5.1 interface ensure compatibility with existing designs and widely available reference platforms.
  • Industrial Reliability: Designed and tested for the -40°C to 85°C operating range, this device meets the demands of applications where consumer-grade components would fail.
  • Optimized Power Efficiency: The 2.7V to 3.6V supply range enables efficient operation in battery-powered or power-sensitive industrial designs.

Why Choose ASFC4G31MA-51BIN?

The ASFC4G31MA-51BIN represents Alliance Memory's commitment to providing industrial-grade memory solutions that meet the rigorous demands of embedded applications. For design engineers requiring a reliable, high-performance eMMC solution that operates across extended temperatures, this device delivers the capacity, interface speed, and environmental resilience needed for mission-critical systems.

With its combination of 4GB storage, 200MHz clock speed capability, and industrial temperature rating, the ASFC4G31MA-51BIN is an excellent choice for new designs as well as upgrades to existing platforms requiring proven, long-term available embedded flash memory.

Get Started

Contact our sales team to discuss your project requirements, request samples, or obtain volume pricing for the ASFC4G31MA-51BIN. Our technical support engineers are available to assist with design integration and answer questions about this industrial eMMC solution.

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