EDFB232A1MA-GD-F-D
| Part Description |
IC DRAM 32GBIT PARALLEL 800MHZ |
|---|---|
| Quantity | 1,855 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Commercial (Extended) | ||
| Clock Frequency | 800 MHz | Voltage | 1.14V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of EDFB232A1MA-GD-F-D – IC DRAM 32GBIT PARALLEL 800MHZ
The EDFB232A1MA-GD-F-D from Micron Technology Inc. is a 32 Gbit DRAM device implemented in Mobile LPDDR3 SDRAM technology. It is organized as 1G × 32 with a parallel memory interface and a clock frequency of 800 MHz, providing a documented configuration for memory-dense designs.
This volatile memory device supports an operating temperature range of -30°C to 85°C and a supply voltage range of 1.14 V to 1.95 V, making it suitable for systems that require mobile LPDDR3 memory characteristics and defined environmental margins.
Key Features
- Memory Technology Mobile LPDDR3 SDRAM technology offering the defined architecture and signaling characteristics of LPDDR3-class devices.
- Capacity & Organization 32 Gbit total capacity, organized as 1G × 32 to support wide-data, high-density memory configurations.
- Clock Performance 800 MHz clock frequency to match designs requiring this specific operating frequency.
- Interface Parallel memory interface for systems designed around parallel DRAM connectivity.
- Voltage Range Operates from 1.14 V to 1.95 V, providing the electrical supply window for system power design.
- Operating Temperature Rated for -30°C to 85°C (TA), supporting a broad range of ambient operating conditions.
- Memory Format DRAM volatile memory intended for applications requiring temporary data storage.
Typical Applications
- Mobile Devices LPDDR3 technology and the specified voltage range align with memory requirements in mobile and handheld systems that use parallel DRAM configurations.
- Embedded Systems High-density 32 Gbit capacity and 1G × 32 organization suit embedded platforms needing substantial temporary memory space.
- Consumer Electronics Parallel DRAM interface and 800 MHz clock frequency match consumer product designs built around LPDDR3 memory architectures.
Unique Advantages
- Defined LPDDR3 Architecture Built on Mobile LPDDR3 SDRAM technology, providing a clear specification match for LPDDR3-based designs.
- High Density in a Single Device 32 Gbit capacity and 1G × 32 organization reduce the number of devices needed to reach target memory sizes.
- Matched Frequency 800 MHz clock frequency supports designs requiring that specific operating point for timing and throughput planning.
- Wide Supply Range 1.14 V to 1.95 V supply window offers flexibility for system power-rail design and integration.
- Extended Ambient Range Rated for -30°C to 85°C to cover a wide span of operating environments for non-automotive applications.
- Vendor Provenance Manufactured by Micron Technology Inc., providing traceable source information for procurement and BOM documentation.
Why Choose EDFB232A1MA-GD-F-D?
The EDFB232A1MA-GD-F-D positions itself as a high-density Mobile LPDDR3 DRAM option for designs that require a 32 Gbit, 1G × 32 organization with an 800 MHz operating point. Its documented voltage range and ambient temperature rating make it a clear technical fit where those electrical and environmental parameters are required.
This device is suited to engineering teams and procurement organizations building mobile, embedded, or consumer products that specify LPDDR3-class memory. Choosing this part provides a defined capacity, interface, and operating envelope from a known memory manufacturer.
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