H26M51002KPR

16GB eMMC 5.1 e-NAND commercial
Part Description

eMMC 5.1, 16GB e-NAND, 250MB/s read, single-die, 153-FBGA

Quantity 160,000 Available (as of October 7, 2026)
Product CategoryeMMC Memory
ManufacturerSK Hynix
Manufacturing StatusActive
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package153-BGA (11.5x13mm)Memory FormatFLASHTechnologyFLASH – NAND (MLC)
Memory Size128 GbitAccess TimeN/AGradeCommercial
Clock Frequency200 MHzVoltage3.3VMemory TypeNon-Volatile
Operating Temperature-25°C – 85°CMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory OrganizationN/AMoisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownECCNEAR99HTS Code8542.32.00.71

Overview of H26M51002KPR – 16GB eMMC 5.1 SK Hynix e-NAND 153-FBGA (11.5x13mm)

The H26M51002KPR is SK Hynix’s 16GB e-NAND, a single 128Gb die paired with an eMMC 5.1 controller in a 153-ball FBGA measuring 11.5 x 13.0 x 0.8mm. That single-die build keeps the package to the thin 0.8mm profile, which helps in slim consumer and handheld designs. The controller manages interface protocols, wear leveling, bad-block management, garbage collection, and ECC on chip, and it guards stored data against sudden host power loss through built-in power-off protection. Advertised as 16GB, the device exposes 15,758,000,128 bytes of user capacity, or 30,777,344 sectors.

Key Features

  • eMMC 5.1 compatible – backward compatible to eMMC 4.5 and 5.0, with 1-bit, 4-bit, and 8-bit bus widths.
  • HS400 interface – up to 400MB/s bus bandwidth via a 200MHz DDR clock, requiring 8-bit width and 1.8V VCCQ.
  • Rated device throughput – 250MB/s sequential read and 45MB/s sequential write, characterized under HS400 with cache on.
  • Dual supply – VCC NAND at 2.7V to 3.6V and VCCQ controller I/O at 1.7V to 1.95V.
  • Command queuing depth 32 – eMMC 5.1 queuing plus cache, cache barrier, HPI, and packed commands sharpen small-transfer handling.
  • Data integrity and service – RPMB, Secure Erase and Trim, Sanitize, Field Firmware Update, and a Health (Smart) report with pre-EOL and device life-time estimation.

Typical Applications

  • Consumer handhelds – the 0.8mm single-die package suits space-constrained portable products.
  • Set-top and networking gear – 16GB holds firmware, OS, and configuration with room for updates.
  • Embedded systems on eMMC 5.1 hosts – a drop-in managed device for SoCs that already speak HS400 or HS200.
  • Point-of-sale and kiosks – RPMB-backed secure storage suits transaction and access-control records.

Unique Advantages

  • Thin single-die footprint – at 0.8mm the 128Gb-x-1 build is thinner than the stacked higher-density parts in the same family.
  • Health monitoring built in – PRE_EOL_INFO and device life-time estimation let the host track wear and flag end-of-life before failure.
  • Read-led performance profile – a 250MB/s read rating favors boot-and-execute and content-delivery workloads, while enhanced data strobe and five selectable driver strengths help hold signal integrity at HS400 speed.

Why Choose H26M51002KPR?

The H26M51002KPR fits designs that want a name-brand 16GB managed device in the thinnest single-die form, on a commercial -25°C to 85°C temperature rating. The 400MB/s rating is the HS400 bus rate, while real device throughput is 250MB/s read and 45MB/s write, and usable capacity is 14.68GB after the controller reserves space for flash management and maintenance. Storage without operation is rated across the wider -40°C to 85°C band, giving margin during shipping and assembly.

Request a quote on the H26M51002KPR for live pricing, stock, and lead time, and let our team know your volume so we can confirm availability and options.

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