FEMC128GCE-E530

AXO 5.1 100ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC128GCE-E530 128GB eMMC 5.1 3D pSLC

Quantity 1,480 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-FBGAMemory FormatFLASHTechnology3D pSLC
Memory Size1.024 TbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging100-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization128G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC128GCE-E530 – 128GB Industrial eMMC 5.1 with 3D pSLC Technology

The FEMC128GCE-E530 is a high-performance 128GB embedded MultiMediaCard (eMMC 5.1) storage solution from Flexxon's AXO Series, engineered specifically for industrial applications. Built on advanced 3D pseudo-Single Level Cell (pSLC) technology, this surface-mount FLASH memory device delivers the enhanced endurance and reliability required for mission-critical embedded systems operating in harsh environments.

Housed in a compact 100-ball FBGA package, the FEMC128GCE-E530 provides 1.024 Tbit of non-volatile storage capacity with an 8-bit organization (128G × 8), operating at clock frequencies up to 200 MHz. Designed for industrial-grade performance across an extended temperature range of -25°C to 85°C, this eMMC module offers flexible dual-voltage I/O support (VCCQ: 1.8V/3.3V) while maintaining RoHS compliance for environmentally conscious designs.

Key Features

  • 3D pSLC NAND Technology
    Delivers significantly enhanced endurance, reliability, and data retention compared to traditional TLC or MLC NAND, making it ideal for write-intensive industrial applications that demand long product lifecycles and consistent performance over time.
  • High-Speed eMMC 5.1 Interface
    Supports clock frequencies up to 200 MHz, enabling fast sequential read and write operations for applications requiring responsive data access and efficient system boot times.
  • 128GB Storage Capacity
    Provides 1.024 Tbit (128G × 8 organization) of non-volatile FLASH memory, offering ample space for operating systems, application code, data logging, and multimedia content in embedded industrial systems.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, ensuring reliable performance in challenging environmental conditions including factory automation, transportation systems, and outdoor industrial equipment.
  • Flexible Voltage Support
    Dual-voltage I/O capability (VCCQ: 1.8V/3.3V) and 3.3V core supply (VCC) provide compatibility with a wide range of host processor platforms and enable design flexibility for power-sensitive applications.
  • Compact Surface Mount Package
    100-ball FBGA package delivers high storage density in a small footprint, ideal for space-constrained embedded designs while facilitating automated manufacturing processes.
  • RoHS Compliant
    Meets environmental compliance standards for lead-free manufacturing, supporting global regulatory requirements and sustainable design practices.

Typical Applications

  • Industrial Automation and Control
    Provides reliable, high-endurance storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial gateways that require frequent data logging and firmware updates in factory environments.
  • Transportation and Fleet Management
    Serves as embedded storage for vehicle telematics systems, digital tachographs, and fleet tracking devices where extended temperature operation and long-term reliability are essential for continuous operation.
  • Medical and Healthcare Equipment
    Delivers the data integrity and endurance needed for portable diagnostic devices, patient monitoring systems, and medical imaging equipment that must maintain reliable operation over extended service lives.
  • Industrial IoT Edge Devices
    Enables robust local data storage and buffering for edge computing platforms, industrial sensors, and smart city infrastructure that require reliable operation in outdoor or harsh industrial environments.
  • Digital Signage and Information Displays
    Powers commercial-grade digital signage, kiosks, and information display systems with the storage capacity and reliability needed for continuous multimedia content playback and frequent content updates.

Unique Advantages

  • Superior Endurance with 3D pSLC:
    The pseudo-SLC mode operation of this 3D NAND device provides significantly higher program/erase cycle endurance compared to native TLC configurations, extending product service life and reducing total cost of ownership in demanding industrial applications.
  • Industrial-Grade Reliability:
    Purpose-built for industrial environments with extended temperature qualification (-25°C to 85°C) and robust design, ensuring consistent operation in applications where consumer-grade components would fail prematurely.
  • Simplified Integration:
    Standard eMMC 5.1 interface and 100-ball FBGA footprint enable straightforward integration with a wide range of industrial processors and system-on-chip (SoC) platforms, accelerating time-to-market and reducing design complexity.
  • Scalable Storage Platform:
    As part of Flexxon's AXO Series offering capacities from 16GB to 512GB, the FEMC128GCE-E530 allows designers to select the optimal storage density for their application while maintaining pin compatibility and design reuse across product variants.
  • Space-Efficient Design:
    Compact 100-ball FBGA surface-mount package minimizes PCB footprint and height, enabling dense board layouts critical for size-constrained industrial equipment and portable devices.
  • Environmental Compliance:
    RoHS-compliant construction ensures compatibility with global environmental regulations and supports corporate sustainability initiatives without compromising performance or reliability.

Why Choose the FEMC128GCE-E530?

The FEMC128GCE-E530 combines the enhanced endurance of 3D pSLC NAND technology with industrial-grade reliability and the proven eMMC 5.1 interface standard, making it an ideal embedded storage solution for demanding industrial applications. Its extended temperature qualification, flexible voltage support, and compact surface-mount package enable reliable operation in harsh environments while simplifying board design and reducing overall system complexity.

For design engineers developing industrial control systems, transportation electronics, medical devices, or IoT edge platforms that demand long service life and consistent performance, the FEMC128GCE-E530 delivers the storage capacity, endurance, and environmental robustness required for mission-critical embedded applications. Its membership in the scalable AXO Series ensures design flexibility and future product roadmap compatibility across varying capacity requirements.

Ready to enhance your industrial design with reliable, high-endurance embedded storage? Request a quote for the FEMC128GCE-E530 today or contact our technical sales team to discuss how this industrial-grade eMMC solution can meet your specific application requirements and performance objectives.

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    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


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