IS22EF04GP-JQLA2-TR

4GB, 100 BALL FBGA, 3.3V, ROHS,
Part Description

4GB, 100 BALL FBGA, 3.3V, ROHS,

Quantity 1,257 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package100-LFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size32 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization4G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of IS22EF04GP-JQLA2-TR – 4GB eMMC NAND Flash (100‑ball FBGA, 3.3V)

The IS22EF04GP-JQLA2-TR is a 4GB (32 Gbit) non-volatile NAND flash memory device organized as 4G × 8 and implemented with MLC technology. It provides an eMMC_5.1 memory interface and is specified with a 200 MHz clock frequency for embedded storage applications.

Designed and manufactured by ISSI, this device targets automotive and embedded systems where high-density, board-mounted flash storage with a compact 100-ball FBGA package and wide operating range is required. Qualification to AEC-Q100 and an operating temperature range of -40°C to 105°C support use in demanding environments.

Key Features

  • Memory Core 
    4GB capacity (32 Gbit) organized as 4G × 8 using MLC NAND technology for non-volatile data storage.
  • Interface & Performance 
    Standard eMMC_5.1 interface with an indicated 200 MHz clock frequency for system integration and data throughput planning.
  • Power 
    Operates from a 2.7V to 3.6V supply range (nominal 3.3V) to match common embedded power domains.
  • Package 
    100-ball FBGA in a 100-LFBGA (14 × 18 mm) supplier device package for compact, board-level mounting.
  • Temperature & Qualification 
    Automotive-grade device with AEC-Q100 qualification and an operating ambient temperature range of -40°C to 105°C.

Typical Applications

  • Automotive systems 
    On-board non-volatile storage for automotive control units and systems that require AEC-Q100-qualified memory and wide temperature operation.
  • Embedded storage for industrial equipment 
    Persistent storage for industrial controllers and appliances operating across extended temperature ranges.
  • Data logging and firmware storage 
    Local high-density flash for system firmware, configuration, and event logging in embedded platforms.

Unique Advantages

  • Automotive-qualified: AEC-Q100 qualification and an automotive grade designation support use in automotive designs.
  • Wide operating temperature: Rated from -40°C to 105°C for reliable operation in harsh and variable environments.
  • High-density, compact package: 4GB capacity in a 100-LFBGA (14 × 18 mm) package helps maximize storage while conserving PCB area.
  • Standard eMMC_5.1 interface: eMMC_5.1 compatibility simplifies integration into systems that use standard embedded memory interfaces.
  • Flexible power supply: 2.7V–3.6V supply range accommodates common 3.3V system rails.

Why Choose IS22EF04GP-JQLA2-TR?

The IS22EF04GP-JQLA2-TR delivers high-capacity, board-mounted NAND flash in a compact 100-ball FBGA package with an eMMC_5.1 interface, making it suitable for designs that require automotive-qualified, non-volatile storage. Its AEC-Q100 qualification and -40°C to 105°C operating range position it for demanding embedded and automotive environments.

This device is appropriate for engineers specifying robust, high-density flash for automotive ECUs, industrial controllers, and other embedded platforms where standardized interfaces, defined voltage operating range, and qualification are required.

Request a quote or submit an inquiry to obtain pricing and availability for IS22EF04GP-JQLA2-TR.

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