IS22EF08GP-JQLA2-TR

The IS22EF08GP-JQLA2-TR is a 64 Gbit (8G × 8) non-volatile NAND flash memory device in a 100-ball FBGA package. It implements MLC NAND technology with an eMMC 5.1 memory interface, targeting embedded designs that require board‑level removable storage in a compact BGA footprint.

Designed for demanding thermal and voltage environments, the device supports a 2.7 V to 3.6 V supply range, a 200 MHz clock domain, and an operating temperature range of −40°C to 105°C. The part carries an AEC‑Q100 qualification and is presented in a 100‑LFBGA (14 × 18 mm) package.

Key Features

• Memory Type & Density — 64 Gbit total capacity organized as 8G × 8, implemented with NAND MLC flash for non‑volatile storage.
• Interface — eMMC 5.1 memory interface for managed NAND operation and standard embedded storage integration.
• Clock — Supports a 200 MHz clock frequency for eMMC timing and data transfer operations.
• Power Supply — Operates from 2.7 V to 3.6 V, accommodating common 3.3 V system rails.
• Package — 100‑ball LFBGA (14 × 18 mm) package appropriate for space‑constrained board layouts.
• Operating Range — −40°C to 105°C ambient operating temperature to meet extended temperature requirements.
• Qualification — AEC‑Q100 qualification indicating suitability for applications requiring automotive-grade component qualification.

Typical Applications

• Automotive Systems — Non-volatile storage for vehicle subsystems where AEC‑Q100 qualification and extended temperature range are required.
• Embedded Systems — Board‑level embedded storage for consumer or industrial products using an eMMC 5.1 interface.
• Data Logging — Local non-volatile memory for log storage in devices operating across wide temperature and voltage ranges.

Unique Advantages

• High Density in Compact Package: 64 Gbit capacity in a 100‑ball LFBGA (14 × 18 mm) provides substantial storage while minimizing PCB area.
• Standard eMMC 5.1 Interface: Managed eMMC interface simplifies integration into existing embedded platforms that support eMMC protocol.
• Automotive Qualification: AEC‑Q100 qualification supports use in applications with automotive component qualification requirements.
• Extended Temperature and Wide Voltage Range: −40°C to 105°C operation and 2.7 V–3.6 V supply range enable robust operation across varied environments and system rails.
• MLC NAND Storage: Multi‑level cell NAND provides a balance of capacity and cost for non‑volatile storage requirements.

Why Choose IS22EF08GP-JQLA2-TR?

The IS22EF08GP-JQLA2-TR positions itself as a high‑capacity, board‑level flash memory solution for designs requiring managed NAND storage with automotive qualification and extended environmental tolerance. Its eMMC 5.1 interface and 64 Gbit density make it suitable for embedded systems, automotive modules, and data logging applications that need reliable non‑volatile memory in a compact BGA package.

This device is well suited to designers seeking a qualified, high‑density eMMC solution that operates across wide temperature and voltage ranges, providing predictable integration into systems where AEC‑Q100 qualification and standard eMMC compatibility are important.

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