IS22TF08G-JCLA2

IC FLASH 64GBIT EMMC 153VFBGA
Part Description

IC FLASH 64GBIT EMMC 153VFBGA

Quantity 115 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCN3A991B1AHTS Code8542.32.0071

Overview of IS22TF08G-JCLA2 – 64 Gbit eMMC (153-VFBGA)

The IS22TF08G-JCLA2 is a 64 Gbit non-volatile NAND flash memory in an eMMC 5.1 format. It implements TLC NAND technology with an 8G × 8 memory organization and is supplied in a compact 153-VFBGA package.

Designed for systems that require high-density embedded flash storage, this device targets automotive and industrial embedded applications where temperature range, voltage flexibility, and industry qualification matter.

Key Features

  • Memory Type & Technology  64 Gbit NAND flash using TLC (Triple-Level Cell) technology organized as 8G × 8 for high-density embedded storage.
  • Interface & Performance  eMMC 5.1 memory interface with a 200 MHz clock frequency to support standard embedded host controllers.
  • Package  153-VFBGA package, footprint 11.5 × 13 mm, suitable for board-level integration in compact system designs.
  • Voltage Supply  Operates from 2.7 V to 3.6 V, enabling compatibility with typical 3.3 V embedded power rails.
  • Operating Temperature  Specified for –40°C to 105°C (TA), supporting operation across a broad environmental range.
  • Qualification  AEC-Q100 qualification, indicating suitability for automotive-grade designs requiring that industry qualification.

Typical Applications

  • Automotive Systems  Embedded storage for infotainment, telematics, and control modules where AEC-Q100 qualification and extended temperature range are required.
  • Industrial Embedded Storage  Local non-volatile storage for controllers, HMIs, and data-logging equipment operating across wide temperature and voltage ranges.
  • Compact Embedded Devices  High-density on-board flash for space-constrained designs that require eMMC 5.1 connectivity and a small BGA footprint.

Unique Advantages

  • High-density TLC NAND: 64 Gbit capacity in an 8G × 8 organization provides substantial on-board storage without external NAND stacks.
  • Standard eMMC 5.1 interface: Simplifies host integration with a widely supported embedded memory interface and a defined command set.
  • Automotive qualification: AEC-Q100 qualification supports automotive development cycles and reliability requirements.
  • Wide operating conditions: –40°C to 105°C rating and 2.7 V–3.6 V supply range enable use in harsh thermal and varied power environments.
  • Compact BGA footprint: 153-VFBGA (11.5 × 13 mm) package provides a space-efficient solution for board-level integration.

Why Choose IS22TF08G-JCLA2?

The IS22TF08G-JCLA2 combines high-density TLC NAND with an eMMC 5.1 interface and AEC-Q100 qualification to deliver a compact, qualified embedded storage option for automotive and industrial designs. Its 153-VFBGA package and broad voltage and temperature specifications make it suitable for integration into space-constrained systems that require robust performance across demanding environments.

This device is appropriate for engineers and procurement teams seeking a verifiable, high-capacity eMMC module that aligns with automotive qualification requirements and common embedded system power rails.

If you need pricing, availability, or a formal quote for IS22TF08G-JCLA2, request a quote or submit an inquiry and our team will respond with the necessary details.

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