IS22TF32G-JQLA1-TR

The IS22TF32G-JQLA1-TR is a 256 Gbit non-volatile NAND flash memory device provided in an eMMC form factor. It implements TLC NAND technology with a 32G × 8 memory organization and an eMMC 5.1 interface for embedded storage applications.

Designed for applications requiring high-density onboard storage, the device offers a 200 MHz clock, AEC‑Q100 qualification, a wide operating temperature range of −40°C to 85°C, and a compact 100‑LFBGA (14×18) package.

Key Features

• Memory Core 256 Gbit NAND flash (TLC) organized as 32G × 8, providing high-density non-volatile storage.
• Interface & Performance eMMC 5.1 memory interface with a 200 MHz clock frequency for host-managed embedded storage integration.
• Power Single-supply operation across a 2.7 V to 3.6 V range to accommodate common embedded system power rails.
• Temperature & Qualification Rated for −40°C to 85°C (TA) and AEC‑Q100 qualified, indicating suitability for environments requiring automotive-grade qualification.
• Package Provided in a 100‑LFBGA package (14 × 18 mm footprint) for compact board-level integration.
• Memory Format & Mounting Non-volatile flash memory in an eMMC packaged format for direct solder mounting to system PCBs.

Typical Applications

• Automotive Systems Onboard storage for automotive modules where AEC‑Q100 qualification and −40°C to 85°C operation are required.
• Embedded & Industrial Controllers High-density program and data storage for embedded controllers and industrial equipment operating across a wide temperature range.
• Infotainment & Telematics eMMC-based media and firmware storage in infotainment or telematics units leveraging the eMMC 5.1 interface.
• Compact Consumer or Appliance Electronics Local non-volatile storage in space-constrained designs using the 100‑LFBGA package.

Unique Advantages

• High-capacity single-device storage: 256 Gbit density (32G × 8) reduces the need for multiple memory components.
• Standard eMMC 5.1 interface: Simplifies integration with hosts that support eMMC memory interfaces.
• Automotive-grade qualification: AEC‑Q100 qualification and industrial temperature rating for demanding environments.
• Wide supply tolerance: 2.7 V to 3.6 V operation supports common system power architectures.
• Compact BGA package: 100‑LFBGA (14×18) offers a small board footprint for space-constrained designs.

Why Choose IS22TF32G-JQLA1-TR?

The IS22TF32G-JQLA1-TR combines high-density TLC NAND flash with an eMMC 5.1 interface and a compact 100‑LFBGA package, delivering a straightforward embedded storage option for designs that require substantial local memory. Its 200 MHz clock capability, wide voltage range, and −40°C to 85°C operating window make it suitable for applications where reliability across temperature and power conditions is important.

With AEC‑Q100 qualification, this device targets customers needing automotive-grade components and long-term robustness in their storage subsystems while keeping board space and integration complexity low.

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