IS25WX064-JHLA3

IC FLASH 64MBIT SPI/OCTL 24TFBGA
Part Description

IC FLASH 64MBIT SPI/OCTL 24TFBGA

Quantity 57 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package24-TFBGA (6x8)Memory FormatFLASHTechnologyFLASH
Memory Size64 MbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage1.7V ~ 2VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 125°C (TA)Write Cycle Time Word PageN/APackaging24-TBGA
Mounting MethodNon-VolatileMemory InterfaceSPI - Octal I/OMemory Organization8M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of IS25WX064-JHLA3 - 64Mbit Octal SPI Flash Memory

The IS25WX064-JHLA3 is a 64Mbit non-volatile flash memory device featuring an advanced octal SPI interface that delivers high-speed data throughput for embedded systems requiring fast boot times and responsive data storage. With an 8M x 8 memory organization and 200MHz clock frequency, this flash memory provides a performance-oriented solution for applications demanding rapid access to program code and data.

Operating across an extended temperature range of -40°C to 125°C, this memory device offers reliability in challenging thermal environments while maintaining a compact 24-TFBGA (6x8mm) footprint. The 1.7V to 2V supply voltage range supports modern low-power designs and compatibility with contemporary microcontroller and processor platforms.

Key Features

  • High-Performance Octal SPI Interface - Supports up to 200MHz clock frequency with octal I/O operation, enabling faster data transfer rates compared to traditional quad SPI interfaces for improved system responsiveness and reduced boot latency.
  • 64Mbit Flash Memory Capacity - Organized as 8M x 8, providing sufficient storage for firmware, application code, data logging, and configuration parameters in embedded applications.
  • Extended Temperature Operation - Rated for -40°C to 125°C ambient temperature range, ensuring reliable operation in industrial, automotive, and outdoor applications exposed to temperature extremes.
  • Low Voltage Operation - Functions on 1.7V to 2V supply, supporting energy-efficient designs and compatibility with low-voltage processors and microcontrollers.
  • Compact Package - 24-TFBGA (6x8mm) package minimizes board space requirements while providing robust electrical performance for space-constrained designs.

Typical Applications

  • Industrial Control Systems - This flash memory provides reliable code storage for PLCs, motor drives, and industrial controllers where the extended temperature range ensures consistent operation in factory floor environments and the high-speed octal interface reduces system boot time.
  • Embedded Computing Platforms - Serves as program storage and data logging memory for processors and microcontrollers in edge computing devices, where the 200MHz interface speed accelerates application loading and the 64Mbit capacity accommodates complex firmware.
  • Medical Instrumentation - Stores firmware and calibration data for diagnostic equipment and patient monitoring systems where non-volatile retention ensures critical configuration data persists through power cycles.
  • Communications Equipment - Provides boot code storage for routers, switches, and network infrastructure where fast boot times minimize downtime during power restoration and firmware updates.
  • Automotive Electronics - Supports infotainment systems, instrument clusters, and vehicle control modules where the extended temperature rating accommodates in-cabin and under-hood thermal environments.

Unique Advantages

  • Faster System Boot Times: The 200MHz octal SPI interface enables rapid code loading, reducing startup latency and improving user experience in applications requiring quick system responsiveness.
  • Extended Environmental Reliability: Operating temperature range of -40°C to 125°C supports deployment in harsh industrial and automotive environments without requiring additional thermal management.
  • Reduced PCB Footprint: The compact 24-TFBGA package (6x8mm) conserves valuable board space, enabling smaller product designs or allowing additional functionality within the same form factor.
  • Lower System Power Consumption: 1.7V to 2V operation aligns with modern low-voltage processor interfaces, reducing power dissipation and supporting battery-powered or energy-conscious designs.
  • Simplified Interface Design: Standard SPI protocol with octal enhancement provides straightforward integration with microcontrollers and processors supporting this industry-standard interface.
  • Non-Volatile Data Retention: Flash technology ensures code and data persist without power, eliminating the need for battery backup or configuration reload after power interruption.

Why Choose IS25WX064-JHLA3?

The IS25WX064-JHLA3 positions itself as a performance-oriented flash memory solution for embedded systems where boot speed, thermal resilience, and compact size are design priorities. Its combination of 200MHz octal SPI interface and extended temperature rating makes it particularly well-suited for industrial control, automotive electronics, and communications infrastructure where both environmental robustness and fast code execution are essential.

For designers seeking to accelerate system boot times while maintaining reliable operation across challenging temperature ranges, this memory device delivers measurable improvements in responsiveness without requiring complex thermal management. The compact package and industry-standard interface streamline integration while minimizing board space allocation.

Get Started

Ready to improve your system's boot performance and thermal reliability? Contact our sales team to discuss your specific application requirements and request a quote for the IS25WX064-JHLA3. Our technical support specialists can assist with interface configuration, timing optimization, and integration guidance for your design.

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