IS42S16320F-6TLI-TR

The IS42S16320F-6TLI-TR is a 512 Mbit volatile memory device implemented in SDRAM technology with a 32M × 16 organization. It provides a parallel memory interface and is offered in a 54‑lead TSOP II package.

Designed for applications that require moderate-density, high-speed parallel DRAM, this device delivers a 167 MHz clock capability, a 5.4 ns access time, and industry-relevant operating ranges for supply voltage and temperature.

Key Features

• Memory Core & Density 512 Mbit capacity organized as 32M × 16, suitable for single-package memory requirements.
• SDRAM Technology Implements SDRAM architecture for synchronous parallel memory operation.
• Performance Rated for a 167 MHz clock frequency with an access time of 5.4 ns, supporting time-sensitive memory access.
• Parallel Interface Standard parallel memory interface for direct integration into systems expecting parallel DRAM.
• Power Supply Operates from 3.0 V to 3.6 V, matching common 3 V memory power domains.
• Package & Mounting Available in a 54‑lead TSOP II package (0.400" / 10.16 mm width) for board-level mounting and space considerations.
• Operating Temperature Specified for operation from -40°C to 85°C (TA), accommodating a wide ambient range.

Typical Applications

• Parallel Memory Expansion For designs requiring a 512 Mbit volatile SDRAM with a parallel interface and 32M × 16 organization.
• Board-Level Memory Upgrades Use as a drop-in high-density DRAM option where a 54‑TSOP II package and 3.0–3.6 V supply are required.
• Temperature-Sensitive Deployments Suitable for systems that require memory operation across an ambient range of -40°C to 85°C.

Unique Advantages

• Single-Package 512 Mbit Density: Consolidates 32M × 16 memory into one 54‑TSOP II device, simplifying board layout for moderate-density needs.
• Clocked Performance Specified: 167 MHz clock rating and 5.4 ns access time provide clearly defined timing characteristics for system timing budgets.
• Wide Operating Voltage Window: 3.0–3.6 V supply range allows compatibility with common 3 V memory power rails.
• Extended Ambient Temperature Range: Specification from -40°C to 85°C supports deployment across a broad set of environmental conditions.
• Compact TSOP II Package: 54‑lead TSOP II (10.16 mm width) offers a compact footprint for board-level integration.

Why Choose IC DRAM 512MBIT PAR 54TSOP II?

The IS42S16320F-6TLI-TR delivers a defined 512 Mbit SDRAM option with explicit performance and operating specifications—32M × 16 organization, 167 MHz clock capability, 5.4 ns access time, 3.0–3.6 V supply, and -40°C to 85°C ambient range—packaged in a 54‑lead TSOP II. These concrete specifications make the device suitable for designs that require a known-performance parallel DRAM solution in a compact package.

This part is appropriate for engineers and procurement teams seeking a stable, specification-driven memory component for board-level integration where parallel SDRAM architecture, medium density, and a broad temperature and voltage operating window are required.

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