IS42S16800F-7B-TR

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 664 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800F-7B-TR – IC DRAM 128MBIT PAR 54TFBGA

The IS42S16800F-7B-TR is a volatile SDRAM device with a 128 Mbit capacity organized as 8M × 16. It provides a parallel memory interface in a 54‑TFBGA (8×8) package and operates from a 3.0 V to 3.6 V supply.

Designed for applications that require synchronous parallel DRAM, the device supports a 143 MHz clock frequency and a 5.4 ns access time within an ambient operating range of 0°C to 70°C.

Key Features

  • Memory Core — SDRAM: 128 Mbit volatile SDRAM organized as 8M × 16 for parallel data paths and conventional DRAM memory architecture.
  • Performance: Specified for operation at a 143 MHz clock frequency with an access time of 5.4 ns, enabling deterministic synchronous read/write timing.
  • Interface & Organization: Parallel memory interface with 16‑bit data organization (8M × 16) for integration into systems expecting a parallel DRAM device.
  • Power: Single supply operation from 3.0 V to 3.6 V, suitable for designs targeting standard 3 V DRAM power rails.
  • Package: 54‑TFBGA (8×8) supplier device package for surface‑mount assembly and board‑level integration.
  • Operating Conditions: Rated for ambient temperatures from 0°C to 70°C (TA), matching typical commercial temperature requirements.

Typical Applications

  • Parallel memory subsystems: Acts as external SDRAM where a 16‑bit parallel memory interface and 128 Mbit capacity are required.
  • Embedded system memory expansion: Provides synchronous DRAM storage for embedded designs that operate on a 3.0 V–3.6 V supply and within 0°C–70°C ambient temperature.
  • Board-level prototyping and evaluation: Suitable for testing and validating parallel SDRAM implementations using the 54‑TFBGA (8×8) package footprint.

Unique Advantages

  • 128 Mbit density: Provides 8M × 16 organization for moderate‑capacity memory needs without requiring multiple devices.
  • Synchronous operation at 143 MHz: Enables uniform timing for designs that require a defined clocked DRAM interface.
  • Fast access time: 5.4 ns access time supports timely data retrieval for performance‑sensitive read operations.
  • Standard 3 V supply range: Operates from 3.0 V to 3.6 V to match common 3 V DRAM power domains.
  • Industry‑standard BGA package: Supplied in a 54‑TFBGA (8×8) package for surface‑mount integration and consistent board placement.
  • Commercial temperature rating: Specified for 0°C to 70°C ambient operation for use in applications within that temperature window.

Why Choose IS42S16800F-7B-TR?

The IS42S16800F-7B-TR is positioned as a straightforward, specification-driven SDRAM option for designs requiring 128 Mbit of parallel synchronous memory. Its combination of an 8M × 16 organization, 143 MHz clock capability, and 5.4 ns access time makes it suitable for systems that need predictable synchronous performance on a standard 3 V power rail.

This device is appropriate for engineers and procurement teams seeking a clear, verifiable DRAM component in a 54‑TFBGA package with a commercial temperature range. Its defined electrical and timing specifications support integration into board‑level memory subsystems and evaluation platforms.

To request pricing, availability, or a formal quote for the IS42S16800F-7B-TR, please submit an inquiry specifying required quantities and delivery timeline.

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