IS42S16800J-7BLI

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 1,451 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800J-7BLI – 128 Mbit SDRAM, 54-TFBGA

The IS42S16800J-7BLI is a 128 Mbit volatile SDRAM organized as 8M × 16, manufactured by Integrated Silicon Solution Inc (ISSI). It provides parallel DRAM storage with a 143 MHz clock capability and an access time of 5.4 ns for systems that require deterministic, board-level dynamic memory.

Designed for integration where compact package size, defined timing, and a standard LVTTL interface are required, this device supports operation across a wide supply voltage range and an extended industrial temperature window.

Key Features

  • Memory Core 128 Mbit SDRAM organized as 8M × 16 (DRAM, volatile) for parallel dynamic memory applications.
  • Performance Clock frequency up to 143 MHz with an access time of 5.4 ns to support time-critical memory operations.
  • Interface LVTTL memory interface for compatibility with board-level logic and MCU/FPGA memory controllers that use LVTTL signaling.
  • Power Operates from a 3.0 V to 3.6 V supply range to match common 3 V system power rails.
  • Package 54-TFBGA package (8 × 8 mm) for compact board footprint and surface-mount assembly.
  • Temperature Range Rated for operation from −40 °C to 85 °C (TA) to accommodate extended-temperature environments.

Typical Applications

  • Parallel SDRAM memory expansion — Provides 128 Mbit of dynamic memory for systems that require an 8M × 16 DRAM organization.
  • Industrial equipment — Extended operating temperature (−40 °C to 85 °C) supports deployment in industrial-grade electronics.
  • Board-level compact systems — 54-TFBGA (8×8) package enables memory integration where PCB space is constrained.

Unique Advantages

  • Deterministic timing: 5.4 ns access time and a 143 MHz clock specification enable predictable memory performance for timing-sensitive designs.
  • Standard LVTTL interface: Simplifies integration with common logic voltage domains and controller architectures that use LVTTL signaling.
  • Flexible supply range: 3.0 V to 3.6 V operation aligns with standard 3 V system rails for straightforward power design.
  • Compact BGA footprint: 54-TFBGA (8×8) reduces PCB area compared with larger packages while supporting surface-mount assembly.
  • Extended temperature rating: −40 °C to 85 °C operation supports deployments in environments with wide thermal variation.
  • Manufacturer support: Produced by Integrated Silicon Solution Inc (ISSI), providing traceable sourcing and device consistency.

Why Choose IS42S16800J-7BLI?

The IS42S16800J-7BLI is positioned for designs that need a reliable 128 Mbit SDRAM in a compact BGA package with defined timing (5.4 ns access) and a 143 MHz clock capability. Its LVTTL interface and 3.0 V–3.6 V supply range make it suitable for systems that require straightforward board-level integration.

With an extended operating temperature range and a compact 54-TFBGA footprint, this device is appropriate for engineers seeking a deterministic, vendor-manufactured SDRAM building block for industrial and compact electronic designs.

Request a quote or submit a sales inquiry to obtain pricing, lead times, and additional ordering information for the IS42S16800J-7BLI.

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