IS42S32200N-6TL

IC DRAM 64MBIT PAR 86TSOP II
Part Description

IC DRAM 64MBIT PAR 86TSOP II

Quantity 1,053 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization2M x 32
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS42S32200N-6TL - 64Mbit SDRAM with 32-bit Wide Interface

The IS42S32200N-6TL is a 64-megabit synchronous dynamic RAM (SDRAM) organized as 2M x 32, offering a wide data bus for high-throughput applications. Built on proven SDRAM technology, this memory device operates at clock frequencies up to 166 MHz with a 5.4 ns access time. Designed for embedded systems requiring substantial parallel data bandwidth, the IS42S32200N-6TL delivers reliable performance in consumer electronics, networking equipment, and industrial computing platforms operating within 0°C to 70°C temperature ranges.

With its 32-bit parallel interface and LVTTL logic levels, this SDRAM simplifies integration into microprocessor and FPGA-based designs while maintaining compatibility with standard memory controller interfaces. The 86-pin TSOP II package provides a compact footprint suitable for space-constrained applications.

Key Features

  • Memory Organization - 2M x 32 architecture provides 64 megabits of volatile storage with a 32-bit wide data bus, enabling efficient data transfers for processors requiring high memory bandwidth.
  • Performance - 166 MHz clock frequency support with 5.4 ns access time delivers responsive memory operations for real-time embedded applications and data buffering tasks.
  • Power Supply - Single 3V to 3.6V supply voltage simplifies power design and maintains compatibility with 3.3V logic systems commonly found in embedded platforms.
  • Interface - LVTTL-compatible inputs and outputs ensure straightforward connection to microcontrollers, DSPs, and FPGAs without requiring level translation circuitry.
  • Package - 86-pin TSOP II package with 10.16mm width offers a proven surface-mount form factor with established manufacturing processes and board layout practices.
  • Operating Range - 0°C to 70°C ambient temperature rating suits commercial and industrial equipment deployed in temperature-controlled environments.

Typical Applications

  • Network Infrastructure - This SDRAM serves as packet buffer memory in routers and switches where the 32-bit interface efficiently handles data streams between network processors and PHY interfaces.
  • Embedded Computing - The device provides main system memory for ARM, MIPS, or PowerPC-based embedded computers running operating systems like Linux, where the 64Mbit capacity supports application code and data structures.
  • Consumer Electronics - Set-top boxes, digital televisions, and multimedia devices use this SDRAM for video frame buffering and graphics operations where the parallel interface matches display controller requirements.
  • Industrial Control Systems - PLCs and HMI panels incorporate this memory for storing program variables and buffering sensor data, with the 0°C to 70°C rating covering typical industrial control cabinet environments.
  • Test and Measurement Equipment - Oscilloscopes and data acquisition systems utilize this SDRAM for waveform storage and signal processing tasks where synchronous operation simplifies timing design.

Unique Advantages

  • Wide Data Bus Reduces Transaction Overhead: The 32-bit interface transfers four bytes per clock cycle, minimizing the number of memory accesses required for block data operations compared to narrower memory devices.
  • Standard SDRAM Timing Simplifies Controller Design: Compliance with JEDEC SDRAM specifications means existing memory controllers and IP cores can interface with this device without custom timing modifications.
  • Single Voltage Supply Reduces BOM Complexity: Operating from a single 3.3V rail eliminates the need for multiple power supply voltages, lowering power management component count and board space requirements.
  • LVTTL Logic Levels Enable Direct Interface: Voltage-compatible inputs and outputs connect directly to 3.3V microcontrollers and FPGAs without external level shifters, reducing design complexity and signal propagation delays.
  • Commercial Temperature Range Suits Standard Deployments: The 0°C to 70°C operating range covers the majority of consumer and commercial equipment installations without requiring extended-temperature or industrial-grade pricing premiums.
  • Established Package Format Supports Proven Assembly: The TSOP II package leverages decades of surface-mount assembly experience, with well-understood thermal characteristics and reliable soldering processes across contract manufacturers.

Why Choose IS42S32200N-6TL?

The IS42S32200N-6TL addresses the memory requirements of embedded systems where a balance of capacity, interface width, and cost-effectiveness is essential. Its 2M x 32 organization is particularly well-suited for designs using 32-bit microprocessors or bus-mastering peripherals that benefit from single-cycle word access. The synchronous interface simplifies timing design compared to asynchronous SRAM while offering higher density and lower cost per bit.

For equipment manufacturers working within commercial temperature ranges, this SDRAM provides a straightforward memory solution backed by ISSI's focus on memory products. The active lifecycle status ensures ongoing availability for product lifecycles extending several years into the future.

Request Pricing and Availability

Contact our sales team to discuss your memory requirements for the IS42S32200N-6TL. We can provide pricing for various order quantities, lead time information, and technical support to assist with memory subsystem integration in your design.

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