IS42S32800J-6TLI

IC DRAM 256MBIT PAR 86TSOP II
Part Description

IC DRAM 256MBIT PAR 86TSOP II

Quantity 1,133 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S32800J-6TLI - 256Mbit Synchronous DRAM

The IS42S32800J-6TLI is a 256-megabit synchronous dynamic random access memory (SDRAM) device organized as 8M x 32 bits. Operating at clock frequencies up to 166 MHz with a 5.4ns access time, this parallel SDRAM delivers reliable performance for embedded systems requiring substantial volatile memory capacity. Housed in an 86-pin TSOP II package, it provides a proven memory solution for industrial and commercial applications.

Designed for extended temperature environments, this SDRAM operates reliably across -40°C to 85°C, making it suitable for industrial controllers, networking equipment, and embedded computing platforms where temperature stability is essential.

Key Features

  • Memory Architecture - 256-megabit capacity organized as 8M x 32-bit configuration provides flexible data width for 32-bit processor interfaces and embedded system designs.
  • Performance Specifications - 166 MHz maximum clock frequency with 5.4ns access time delivers responsive read/write operations for real-time control and data processing applications.
  • Power Supply - Single 3V to 3.6V voltage supply simplifies power distribution and reduces overall system power requirements.
  • Operating Temperature Range - -40°C to 85°C ambient temperature rating ensures consistent operation in industrial environments with temperature fluctuations.
  • Package - 86-pin TSOP II package (0.400" / 10.16mm width) provides a compact footprint for space-constrained PCB layouts.
  • Interface - Parallel memory interface enables straightforward integration with microprocessors, DSPs, and FPGAs using standard SDRAM protocols.

Typical Applications

  • Industrial Automation - This SDRAM provides reliable memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where extended temperature tolerance ensures consistent operation in factory floor environments.
  • Embedded Computing - Serves as main system memory in embedded processors and single-board computers running real-time operating systems that require substantial RAM capacity with predictable access patterns.
  • Networking Equipment - Functions as packet buffer memory in routers, switches, and network processors where high-speed synchronous operation supports efficient data handling and low-latency packet forwarding.
  • Test and Measurement - Provides data capture and storage capabilities in oscilloscopes, logic analyzers, and automated test equipment where the wide temperature range accommodates varied operating conditions.
  • Medical Devices - Supports data processing and image buffering in diagnostic equipment and patient monitoring systems where reliable operation across temperature variations is required.

Unique Advantages

  • Industrial Temperature Range: The -40°C to 85°C operating specification eliminates the need for additional thermal management in many industrial installations, reducing system complexity and cost.
  • Standard SDRAM Interface: Compatible with widely-supported SDRAM controller IP and memory interface standards, minimizing development time and enabling design reuse across product families.
  • Single Voltage Operation: 3V to 3.6V supply reduces power distribution complexity compared to older DRAM technologies requiring multiple voltage rails.
  • Proven TSOP II Package: The industry-standard package format ensures compatibility with established PCB assembly processes and enables straightforward sourcing of production quantities.
  • Synchronous Operation: Clock-synchronous design simplifies timing constraints and system integration compared to asynchronous DRAM architectures.
  • Active Lifecycle Status: Ongoing production availability supports long product lifecycles typical of industrial and embedded applications.

Why Choose IS42S32800J-6TLI?

The IS42S32800J-6TLI addresses the requirements of embedded and industrial system designers who need substantial volatile memory capacity with reliable operation across extended temperature ranges. Its 32-bit organization aligns with common processor data bus widths, while the 256-megabit density provides adequate memory for embedded operating systems, application code, and data buffers without requiring multiple memory devices.

For designs prioritizing long-term availability, straightforward integration, and proven reliability in industrial environments, this SDRAM offers a practical memory solution backed by ISSI's experience in the memory market.

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Contact our sales team to discuss pricing, availability, and technical support for the IS42S32800J-6TLI in your application. We can provide detailed specifications, reference designs, and assistance with memory subsystem integration.

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