IS43R86400E-6BLI-TR

IC DRAM 512MBIT PAR 60TFBGA
Part Description

IC DRAM 512MBIT PAR 60TFBGA

Quantity 368 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency166 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS43R86400E-6BLI-TR – IC DRAM 512Mbit PAR 60TFBGA

The IS43R86400E-6BLI-TR is a volatile DDR SDRAM device providing 512 Mbit of parallel DRAM organized as 64M × 8. It implements DDR SDRAM architecture with a parallel memory interface and operates from a 2.3 V to 2.7 V supply.

With a 60‑TFBGA (8×13) package, a specified clock frequency of 166 MHz and a typical access time of 700 ps, this device targets designs that require compact, high‑density volatile memory in a ball‑grid array package and a wide operating temperature range.

Key Features

  • Memory Type: DDR SDRAM (volatile) implemented as 64M × 8 organization, providing 512 Mbit of storage.
  • Performance: Specified clock frequency of 166 MHz with an access time of 700 ps and a write cycle time (word page) of 15 ns to characterize timing behavior.
  • Voltage and Power: Operates from a 2.3 V to 2.7 V supply range.
  • Interface: Parallel memory interface compatible with DDR SDRAM signaling.
  • Package: 60‑TFBGA (8×13) supplier device package for compact board footprint and BGA mounting.
  • Operating Temperature: Specified ambient operating range of −40°C to 85°C (TA).

Typical Applications

  • System Memory: Use as parallel DDR SDRAM memory in systems requiring 512 Mbit volatile storage with 64M × 8 organization.
  • Embedded Platforms: Suitable for embedded designs needing a compact 60‑TFBGA package and a 2.3 V–2.7 V power envelope.
  • Board‑Level Memory Expansion: Suitable for board designs that require predictable timing (166 MHz clock, 700 ps access time) and defined write cycle timing (15 ns).

Unique Advantages

  • High‑density DRAM: 512 Mbit capacity in a 64M × 8 organization provides substantial volatile storage in a single device.
  • Compact BGA Package: 60‑TFBGA (8×13) package enables a small board footprint while supporting ball‑grid array mounting.
  • Defined Performance Specs: 166 MHz clock frequency and 700 ps access time give clear timing characteristics for system design and validation.
  • Low‑voltage Operation: 2.3 V to 2.7 V supply range supports designs targeting lower supply rails.
  • Wide Operating Temperature: −40°C to 85°C ambient range for deployment across a broad set of environmental conditions.
  • Parallel DDR Interface: Parallel memory interface simplifies integration into systems expecting DDR SDRAM signaling and timing.

Why Choose IS43R86400E-6BLI-TR?

The IS43R86400E-6BLI-TR delivers a compact, 512 Mbit DDR SDRAM solution with defined timing and electrical characteristics—166 MHz clock, 700 ps access time, 15 ns write cycle time, and a 2.3 V–2.7 V supply—packaged in a 60‑TFBGA footprint. Its 64M × 8 organization and parallel interface make it suitable for designs that require clear, verifiable memory performance and a small board area.

This device is appropriate for engineers specifying volatile DDR memory where predictable timing, low‑voltage operation, and a wide ambient temperature range are required. Its specification set supports straightforward evaluation, integration, and system validation in projects that match the listed electrical and mechanical parameters.

Request a quote or submit an inquiry for IS43R86400E-6BLI-TR to obtain pricing and availability information.

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