IS43R86400F-6TL-TR

IC DRAM 512MBIT SSTL 66TSOPII
Part Description

IC DRAM 512MBIT SSTL 66TSOPII

Quantity 1,337 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency167 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceSSTL_2Memory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS43R86400F-6TL-TR – IC DRAM 512MBIT SSTL 66TSOPII

The IS43R86400F-6TL-TR is a 512 Mbit DDR SDRAM device organized as 64M × 8, manufactured by Integrated Silicon Solution Inc (ISSI). It implements a DDR SDRAM architecture with an SSTL_2 memory interface and is supplied in a 66‑TSSOP / 66‑TSOP II package.

This device is intended for board‑level external memory applications that require a compact 512 Mbit DDR DRAM with defined electrical and timing characteristics, including a 167 MHz clock frequency, 700 ps access time, and a supply range of 2.3 V to 2.7 V.

Key Features

  • Memory Architecture DDR SDRAM technology organized as 64M × 8 for a total memory capacity of 512 Mbit.
  • Interface SSTL_2 memory interface compatible with SSTL_2 signaling requirements as specified for the device.
  • Performance 167 MHz clock frequency and 700 ps access time with a word page write cycle time of 15 ns for predictable timing behavior.
  • Power Operates from a 2.3 V to 2.7 V supply range.
  • Package 66‑TSSOP (0.400", 10.16 mm width) / 66‑TSOP II package for compact board integration.
  • Operating Temperature Specified for 0 °C to 70 °C ambient (TA).
  • Memory Format Volatile DRAM suitable for external system memory and buffering applications.

Typical Applications

  • Embedded system external memory — Provides DDR external RAM for embedded platforms that require a 512 Mbit memory array.
  • FPGA external DDR memory — Used as board‑level DDR memory for FPGAs and programmable logic where an SSTL_2 interface is present.
  • Board‑level data buffering — Suitable for applications requiring transient data storage and buffering with defined timing characteristics.

Unique Advantages

  • High density in a compact package: 512 Mbit capacity delivered in a 66‑TSSOP / 66‑TSOP II package (10.16 mm width) for space‑constrained designs.
  • SSTL_2 signaling: Native SSTL_2 memory interface support aligns the device with controllers and systems using SSTL_2 standards.
  • Defined timing performance: 167 MHz clock frequency, 700 ps access time, and 15 ns write cycle time provide measurable performance metrics for system design.
  • Low‑voltage operation: 2.3 V to 2.7 V supply range supports lower voltage system rail architectures.
  • Commercial temperature rating: Specified for 0 °C to 70 °C operation for typical commercial environments.
  • Manufactured by ISSI: Produced by Integrated Silicon Solution Inc, providing traceable sourcing information.

Why Choose IS43R86400F-6TL-TR?

The IS43R86400F-6TL-TR offers a straightforward DDR SDRAM solution when a 512 Mbit, 64M × 8 memory is required with SSTL_2 interfacing and compact board footprint. Its documented clock, access, and cycle timing characteristics make it suitable for designs that need predictable external DRAM behavior within a 2.3 V–2.7 V power envelope.

Choose this device for designs that prioritize a known commercial temperature range (0 °C to 70 °C), compact 66‑TSSOP / 66‑TSOP II packaging, and a clear set of electrical and timing specifications from a recognized memory manufacturer.

Request a quote or submit a parts inquiry to check pricing and availability for the IS43R86400F-6TL-TR.

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