IS45S32200N-7BLA2
| Part Description |
IC DRAM 64MBIT PAR 90TFBGA |
|---|---|
| Quantity | 986 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Automotive | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | LVTTL | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of IS45S32200N-7BLA2 – IC DRAM 64MBIT PAR 90TFBGA
The IS45S32200N-7BLA2 is a 64 Mbit synchronous dynamic RAM (SDRAM) organized as 2M × 32. It provides clocked SDRAM performance with a specified clock frequency of 143 MHz and an access time of 5.4 ns.
Designed for applications that require compact, board-level DRAM capacity, this device combines a 90-TFBGA (8×13) package with a LVTTL memory interface and a 3.0 V–3.6 V supply range, and supports an operating ambient temperature range of -40°C to 105°C.
Key Features
- Memory Architecture 64 Mbit SDRAM organized as 2M × 32, providing a wide 32-bit data path for system memory and buffering tasks.
- Performance Clock frequency rated at 143 MHz with a typical access time of 5.4 ns, enabling synchronous, clocked memory operations.
- Interface and Signaling LVTTL memory interface for logic-level compatibility with systems expecting LVTTL signaling.
- Power Supports a supply voltage range of 3.0 V to 3.6 V for integration into 3 V-class designs.
- Package Supplied in a 90-TFBGA (8×13) package, offering a compact footprint for high-density board layouts.
- Operating Range Rated for ambient operating temperatures from -40°C to 105°C (TA), suitable for a broad set of environmental conditions.
Typical Applications
- Embedded Systems Provides synchronous DRAM capacity for system memory and buffering in embedded controller and module designs.
- Consumer and Industrial Electronics Compact 90-TFBGA package and 64 Mbit capacity fit memory requirements where board space is constrained.
- Data Buffering 2M × 32 organization supports wide-data buffering and temporary storage in digital subsystems.
Unique Advantages
- Compact, high-density memory: 64 Mbit capacity in a 90-TFBGA (8×13) package reduces PCB area compared with larger packages.
- Synchronous performance: 143 MHz clock rating and 5.4 ns access time provide predictable, clocked SDRAM behavior for timing-critical designs.
- <strong_Wide data path: 2M × 32 organization delivers a 32-bit data interface for efficient data transfers and buffering.
- 3 V-class power compatibility: 3.0 V–3.6 V supply range aligns with standard 3 V system rails.
- Extended temperature capability: -40°C to 105°C ambient rating supports deployment across diverse environmental conditions.
- Established manufacturer: Produced by Integrated Silicon Solution Inc., providing traceable device identification.
Why Choose IS45S32200N-7BLA2?
The IS45S32200N-7BLA2 offers a balance of synchronous performance, compact packaging and a wide operating temperature range, making it suitable for designs that require a reliable 64 Mbit DRAM solution in a space-efficient 90-TFBGA footprint. Its 2M × 32 organization and LVTTL interface simplify integration into systems that need a wide data path and standard logic-level signaling.
This device is appropriate for engineers and procurement teams specifying board-level SDRAM where predictable clocked operation, a 3 V-class supply and extended ambient temperature support are key selection criteria.
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