IS46DR16160B-25DBLA2

IC DRAM 256MBIT PAR 84TWBGA
Part Description

IC DRAM 256MBIT PAR 84TWBGA

Quantity 1,541 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package84-TWBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size256 MbitAccess Time400 psGradeAutomotive
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS46DR16160B-25DBLA2 - 256Mbit DDR2 SDRAM

The IS46DR16160B-25DBLA2 is a 256-megabit DDR2 SDRAM memory device from ISSI, Integrated Silicon Solution Inc, organized as 16 million words by 16 bits. This parallel interface DRAM operates at a 400MHz clock frequency with a 0.4ns access time, making it ideal for applications requiring fast, reliable volatile memory in compact footprints. With an extended operating temperature range of -40°C to 105°C, this device serves industrial, embedded, and automotive-adjacent systems that demand performance across challenging thermal environments.

Key Features

  • Memory Architecture - 256Mbit capacity organized as 16M x 16, providing flexible addressing for word-oriented data structures and efficient memory mapping in embedded controllers.
  • DDR2 SDRAM Technology - Double data rate operation at 400MHz clock frequency delivers high bandwidth while maintaining compatibility with standard DDR2 interfaces and controllers.
  • Fast Access Time - 0.4ns access time and 15ns write cycle time ensure low-latency data retrieval and rapid transaction processing for time-sensitive applications.
  • Extended Temperature Range - -40°C to 105°C ambient operating range qualifies this device for industrial automation, outdoor equipment, and harsh-environment deployments where commercial-grade components fail.
  • Compact TWBGA Package - 84-pin Thin Very Fine Ball Grid Array (8mm x 12.5mm footprint) minimizes board space while providing robust mechanical connections for high-reliability assemblies.
  • Low Voltage Operation - 1.7V to 1.9V supply voltage reduces power consumption and heat generation, extending battery life in portable systems and simplifying thermal management.

Typical Applications

  • Industrial Automation Controllers - This DDR2 SDRAM provides working memory for PLCs, motion controllers, and industrial PCs where extended temperature tolerance ensures reliable operation in factory floors and outdoor enclosures subject to temperature extremes.
  • Embedded Computing Systems - The compact TWBGA package and parallel interface make this device well-suited for embedded processors and SoCs in networking equipment, medical devices, and test instruments where board space is constrained.
  • Automotive Infotainment and Telematics - While not automotive-qualified, the extended temperature range supports infotainment systems, navigation units, and telematics modules in vehicle applications that require memory performance across wide thermal excursions.
  • Telecommunications Infrastructure - The 400MHz clock frequency and low-latency access support buffering and data handling in base stations, routers, and switching equipment where fast memory transactions maintain network throughput.
  • Portable and Battery-Powered Equipment - Low voltage operation from 1.7V to 1.9V reduces power draw in handheld instruments, mobile data collectors, and field service devices where battery life is critical.

Unique Advantages

  • Thermal Resilience for Harsh Environments: The -40°C to 105°C operating range eliminates the need for active cooling or heating in many industrial and outdoor installations, reducing system complexity and maintenance.
  • Compact Footprint with High Density: 256Mbit capacity in an 8mm x 12.5mm TWBGA package maximizes memory per square millimeter, enabling denser board layouts and smaller end products.
  • DDR2 Interface Compatibility: Standard DDR2 SDRAM signaling ensures drop-in compatibility with existing controller designs and broad ecosystem support for drivers, validation tools, and reference designs.
  • Low Power for Energy Efficiency: 1.7V to 1.9V operation minimizes energy consumption compared to higher-voltage memory technologies, reducing battery drain and heat dissipation in portable or passively cooled systems.
  • Parallel Interface Simplicity: Direct parallel data bus eliminates protocol overhead and latency associated with serial memory interfaces, simplifying firmware and enabling deterministic access patterns.
  • Active Lifecycle Status: This device is in active production, ensuring long-term availability for new designs and field service spares without obsolescence risk.

Why Choose the IS46DR16160B-25DBLA2?

The IS46DR16160B-25DBLA2 combines DDR2 performance with industrial-grade temperature tolerance in a space-efficient package, making it an excellent choice for embedded systems that operate beyond commercial temperature limits. Its 256Mbit density strikes a balance between capacity and cost for applications such as industrial controllers, telecommunications equipment, and automotive peripherals. The device's active lifecycle status and standard DDR2 interface reduce design risk and shorten development cycles, while the low voltage operation and compact TWBGA footprint support modern power and size constraints.

For system architects and procurement teams seeking reliable, temperature-tolerant memory for embedded and industrial designs, the IS46DR16160B-25DBLA2 delivers proven DDR2 technology with the thermal resilience and packaging required for demanding deployment environments.

Request a Quote

Contact our sales team for pricing, availability, and volume discounts on the IS46DR16160B-25DBLA2. Our technical support staff can assist with integration questions, reference designs, and application-specific recommendations to ensure successful deployment in your next project.

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