KGD-64Mbx16-LPDDR3-SDRAM-1.2V

LPDDR3 SDRAM KGD
Part Description

LPDDR3 SDRAM 1.2V

Quantity 670 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyLPDDR3 SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization64M x 16
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.32

Overview of KGD-64Mbx16-LPDDR3-SDRAM-1.2V – LPDDR3 SDRAM 1.2V

The KGD-64Mbx16-LPDDR3-SDRAM-1.2V is a memory product from ESMT identified by LPDDR3 SDRAM architecture and a 64M × 16 organization. It is provided as a Known Good Die (KGD) grade part intended for use where die-level integration or custom packaging is required.

Product data lists the part name as "LPDDR3 SDRAM 1.2V" and includes a voltage supply specification of 2.5V. The part is RoHS compliant and is positioned for system-level memory integration where LPDDR3 SDRAM technology and KGD delivery are required.

Key Features

  • Technology — LPDDR3 SDRAM Specified as LPDDR3 SDRAM technology for designs referencing this series.
  • Memory Organization — 64M × 16 Delivered with a 64M × 16 bit organization suitable for designers specifying this density and data width.
  • Memory Type & Format Volatile memory implemented as DRAM for temporary data storage in system applications.
  • Interface — Parallel Uses a parallel memory interface as indicated in the product specifications.
  • Voltage Supply Product data lists a voltage supply of 2.5V.
  • Grade — Known Good Die (KGD) Supplied as Known Good Die, enabling die-level integration and assembly workflows.
  • Compliance RoHS compliant as stated in the product information.
  • Manufacturer & Series Manufactured by ESMT and listed in the ESMT LPDDR3 SDRAM KGD-64Mbx16-LPDDR3-SDRAM-1.2V series.

Typical Applications

  • Embedded systems — Temporary system memory where LPDDR3 SDRAM architecture and 64M × 16 organization meet design requirements.
  • Module and package assembly — KGD format supports custom packaging and board-level assembly workflows requiring verified die.
  • Evaluation and test platforms — Use in characterization, test, and validation environments that require die-level LPDDR3 components.
  • Consumer and electronic devices — Integration into designs that reference LPDDR3 DRAM technology and the specified memory organization.

Unique Advantages

  • Known Good Die delivery: KGD grade reduces assembly risk by supplying dies that have passed wafer-level verification.
  • Clear memory organization: 64M × 16 configuration provides a defined density and data-width option for system designers.
  • Parallel interface: Parallel memory interface is specified for integration into compatible memory subsystems.
  • RoHS compliance: Environmentally compliant material declaration as indicated in product data.
  • Series consistency: Part of the ESMT LPDDR3 SDRAM KGD series for consistent sourcing within the same technology family.

Why Choose KGD-64Mbx16-LPDDR3-SDRAM-1.2V?

KGD-64Mbx16-LPDDR3-SDRAM-1.2V is positioned for designs that require LPDDR3 SDRAM technology delivered as Known Good Die. The combination of a defined 64M × 16 organization, parallel interface, and KGD grade supports die-level integration, module assembly, and test workflows where verified die is necessary.

This ESMT part is suitable for customers and designs that prioritize die-level availability and clear, verifiable specifications. RoHS compliance and series affiliation with ESMT LPDDR3 SDRAM KGD parts provide consistency for procurement and integration planning.

Request a quote or submit a pricing inquiry to discuss availability, volume pricing, and delivery for the KGD-64Mbx16-LPDDR3-SDRAM-1.2V from ESMT.

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