KGD-64Mbx16-LPDDR3-SDRAM-1.2V
| Part Description |
LPDDR3 SDRAM 1.2V |
|---|---|
| Quantity | 670 Available (as of May 6, 2026) |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | LPDDR3 SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | N/A | Access Time | N/A | Grade | Known Good Die | ||
| Clock Frequency | N/A | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | Parallel | Memory Organization | 64M x 16 | ||
| Moisture Sensitivity Level | 1 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.32 |
Overview of KGD-64Mbx16-LPDDR3-SDRAM-1.2V – LPDDR3 SDRAM 1.2V
The KGD-64Mbx16-LPDDR3-SDRAM-1.2V is a memory product from ESMT identified by LPDDR3 SDRAM architecture and a 64M × 16 organization. It is provided as a Known Good Die (KGD) grade part intended for use where die-level integration or custom packaging is required.
Product data lists the part name as "LPDDR3 SDRAM 1.2V" and includes a voltage supply specification of 2.5V. The part is RoHS compliant and is positioned for system-level memory integration where LPDDR3 SDRAM technology and KGD delivery are required.
Key Features
- Technology — LPDDR3 SDRAM Specified as LPDDR3 SDRAM technology for designs referencing this series.
- Memory Organization — 64M × 16 Delivered with a 64M × 16 bit organization suitable for designers specifying this density and data width.
- Memory Type & Format Volatile memory implemented as DRAM for temporary data storage in system applications.
- Interface — Parallel Uses a parallel memory interface as indicated in the product specifications.
- Voltage Supply Product data lists a voltage supply of 2.5V.
- Grade — Known Good Die (KGD) Supplied as Known Good Die, enabling die-level integration and assembly workflows.
- Compliance RoHS compliant as stated in the product information.
- Manufacturer & Series Manufactured by ESMT and listed in the ESMT LPDDR3 SDRAM KGD-64Mbx16-LPDDR3-SDRAM-1.2V series.
Typical Applications
- Embedded systems — Temporary system memory where LPDDR3 SDRAM architecture and 64M × 16 organization meet design requirements.
- Module and package assembly — KGD format supports custom packaging and board-level assembly workflows requiring verified die.
- Evaluation and test platforms — Use in characterization, test, and validation environments that require die-level LPDDR3 components.
- Consumer and electronic devices — Integration into designs that reference LPDDR3 DRAM technology and the specified memory organization.
Unique Advantages
- Known Good Die delivery: KGD grade reduces assembly risk by supplying dies that have passed wafer-level verification.
- Clear memory organization: 64M × 16 configuration provides a defined density and data-width option for system designers.
- Parallel interface: Parallel memory interface is specified for integration into compatible memory subsystems.
- RoHS compliance: Environmentally compliant material declaration as indicated in product data.
- Series consistency: Part of the ESMT LPDDR3 SDRAM KGD series for consistent sourcing within the same technology family.
Why Choose KGD-64Mbx16-LPDDR3-SDRAM-1.2V?
KGD-64Mbx16-LPDDR3-SDRAM-1.2V is positioned for designs that require LPDDR3 SDRAM technology delivered as Known Good Die. The combination of a defined 64M × 16 organization, parallel interface, and KGD grade supports die-level integration, module assembly, and test workflows where verified die is necessary.
This ESMT part is suitable for customers and designs that prioritize die-level availability and clear, verifiable specifications. RoHS compliance and series affiliation with ESMT LPDDR3 SDRAM KGD parts provide consistency for procurement and integration planning.
Request a quote or submit a pricing inquiry to discuss availability, volume pricing, and delivery for the KGD-64Mbx16-LPDDR3-SDRAM-1.2V from ESMT.
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