KGD-8Mbx32-LPDDR-SDRAM-1.8V

LPDDR SDRAM KGD
Part Description

LPDDR SDRAM 1.8V

Quantity 1,388 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyLPDDR SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization8M x 32
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.24

Overview of KGD-8Mbx32-LPDDR-SDRAM-1.8V – LPDDR SDRAM 1.8V

The KGD-8Mbx32-LPDDR-SDRAM-1.8V from ESMT is a volatile DRAM device in a Known Good Die (KGD) format, using LPDDR SDRAM technology. It is organized as 8M × 32 with a parallel memory interface and is provided by the ESMT LPDDR SDRAM KGD-8Mbx32-LPDDR-SDRAM-1.8V series.

Designed for integration into systems that require discrete DRAM storage, this product is RoHS compliant and offered by ESMT as a KGD option to support wafer- or die-level integration workflows.

Key Features

  • Memory Type  Volatile memory implemented as DRAM, suitable for temporary data storage in electronic systems.
  • Technology  LPDDR SDRAM architecture as specified for the series, providing standard LPDDR signaling and behavior.
  • Memory Organization  8M × 32 organization, offering a clear density and data width specification for system planning.
  • Memory Interface  Parallel interface, enabling integration with parallel memory controllers and designs that use parallel DRAM connectivity.
  • Grade  Known Good Die (KGD) grade for die-level integration use cases and improved upstream test visibility.
  • Voltage Supply  VoltageSupply listed as 2.5V in the product specification set.
  • Compliance  RoHS compliant, meeting common environmental requirements for lead-free assembly.
  • Manufacturer & Series  Produced by ESMT as part of the ESMT LPDDR SDRAM KGD-8Mbx32-LPDDR-SDRAM-1.8V series.

Typical Applications

  • Volatile DRAM Storage  Use where transient data storage is required; the device's DRAM format and 8M × 32 organization define capacity and bus width for system designers.
  • Parallel Interface Systems  Integration into systems that utilize parallel memory interfaces, leveraging the specified parallel connectivity.
  • Die-Level Integration  Known Good Die grade supports wafer- or die-level assembly processes and workflows.

Unique Advantages

  • Clear memory organization: The 8M × 32 configuration provides explicit density and data-width information to streamline BOM and memory map planning.
  • KGD grade for die integration: Known Good Die classification supports downstream assembly and yield management in die-level production flows.
  • Parallel interface compatibility: Specified parallel memory interface simplifies integration with parallel controller architectures.
  • RoHS compliance: Environmentally compliant material set supports lead-free assembly requirements.
  • Manufacturer backing: Offered by ESMT as part of a dedicated LPDDR SDRAM KGD series for consistent sourcing.

Why Choose KGD-8Mbx32-LPDDR-SDRAM-1.8V?

KGD-8Mbx32-LPDDR-SDRAM-1.8V is positioned for designs that require a clearly specified LPDDR SDRAM device in a Known Good Die format. With its 8M × 32 organization, parallel interface, and RoHS compliance, it provides a straightforward option for engineers planning die-level integration or parallel memory implementations.

This ESMT product is suited for teams that prioritize die-grade components and transparent memory specifications during system design and procurement, offering predictable sourcing within the ESMT LPDDR SDRAM KGD series.

Request a quote or submit an inquiry to receive pricing and availability information for KGD-8Mbx32-LPDDR-SDRAM-1.8V.

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