M14F5121632A (2G)

The M14F5121632A (2G) from ESMT is a DDR2 SDRAM device provided in a compact 84-ball BGA package. It implements a 32M × 16 memory organization delivering 536.9 Mbit of volatile DRAM storage using DDR2 SDRAM technology.

With a 667 MHz clock frequency, 15 ns access timing and JEDEC qualification, the device targets board-level designs requiring parallel DDR2 memory with defined thermal and electrical characteristics. It is a commercial-grade, RoHS-compliant component specified for surface-mount assembly.

Key Features

• Core Technology 
  DDR2 SDRAM architecture providing high-speed synchronous DRAM operation as specified in the product data.
• Memory Organization & Capacity 
  32M × 16 organization delivering 536.9 Mbit of volatile DRAM capacity suitable for parallel memory implementations.
• Performance 
  667 MHz clock frequency and a 15 ns access time with a 15 ns write cycle time (word/page) for deterministic read/write timing.
• Power 
  Specified voltage supply of 2.5 V as listed in the product specifications.
• Interface & Mounting 
  Parallel memory interface in a surface-mount 84 Ball BGA package for compact board integration.
• Package & Thermal 
  84 Ball BGA supplier device package with an operating temperature range of 0 °C to 95 °C for commercial environments.
• Qualification & Compliance 
  JEDEC-qualified device grade (Commercial) and RoHS compliant per the provided product information.

Typical Applications

• Parallel memory subsystems 
  Designs that require a parallel DDR2 interface with a 32M × 16 organization and 536.9 Mbit capacity.
• Board-level DRAM implementations 
  Surface-mount BGA integration where compact package geometry and JEDEC qualification are required.
• Commercial electronic products 
  Systems operating within a 0 °C to 95 °C range that need RoHS-compliant, commercially graded DDR2 memory.

Unique Advantages

• Defined JEDEC qualification: 
  Supplied as a JEDEC-qualified part, enabling consistent behavior within JEDEC-defined DDR2 design parameters.
• Compact BGA footprint: 
  84 Ball BGA package supports high-density board layouts and surface-mount assembly processes.
• High-frequency operation: 
  667 MHz clock frequency supports designs that need faster synchronous DRAM timing within DDR2 specifications.
• Deterministic timing: 
  15 ns access time and 15 ns write cycle time provide clear timing windows for memory subsystem design.
• Commercial-grade thermal range: 
  0 °C to 95 °C operating temperature accommodates a wide range of commercial applications.
• Regulatory compliance: 
  RoHS compliance supports environmental and manufacturing requirements for lead-free production.

Why Choose M14F5121632A (2G)?

M14F5121632A (2G) is positioned for designs that require a JEDEC-qualified DDR2 SDRAM device in a compact 84 Ball BGA package, offering a clear combination of capacity (536.9 Mbit), organization (32M × 16), and defined timing (667 MHz clock, 15 ns access). Its commercial-grade specification and RoHS compliance make it suitable where standardized memory characteristics and regulatory conformance are required.

This device is appropriate for engineers and procurement teams specifying parallel DDR2 memory with explicit electrical, timing and thermal parameters. Its combination of package, qualification and operating specifications supports scalable, reliable integration in board-level applications within the stated commercial environment.

Request a quote or submit an inquiry to receive pricing and availability information for M14F5121632A (2G).