MT29F256G08AUAAAC5-ITZ:A TR

The MT29F256G08AUAAAC5-ITZ:A TR is a 256 Gbit non-volatile NAND flash memory in a parallel interface format. Implemented with SLC (single-level cell) NAND technology and organized as 32G × 8, it provides high-density on-board storage in a 52-VLGA package.

This device is intended for designs that require high-capacity parallel flash storage with a 2.7 V to 3.6 V supply range and an operating temperature from -40°C to 85°C, making it suitable for embedded systems and other applications that need compact, high-density non-volatile memory.

Key Features

• Memory Type — Non-volatile FLASH NAND (SLC) technology providing single-level cell storage for the device.
• Density & Organization — 256 Gbit capacity organized as 32G × 8 for high-density on-board storage.
• Interface — Parallel memory interface for integration with systems designed for parallel flash connectivity.
• Voltage Supply — Operates from 2.7 V to 3.6 V, supporting standard 3.3 V system rails.
• Package — 52-VLGA package (supplier device package: 52-VLGA (18x14)) for compact board-level mounting.
• Operating Temperature — Rated for -40°C to 85°C (TA) to support extended ambient environments.

Typical Applications

• Embedded Storage — High-capacity non-volatile storage for embedded systems that require 256 Gbit of onboard FLASH memory in a parallel interface.
• Industrial Equipment — Storage for control systems and instrumentation where wide operating temperature and stable voltage range are required.
• Legacy Parallel-Interface Systems — Replacement or capacity upgrade in designs that use parallel NAND flash connectivity and require a 52-VLGA package footprint.

Unique Advantages

• High Density 256 Gbit Capacity: Enables substantial on-board storage in a single device, reducing the need for multiple components.
• SLC NAND Technology: Uses single-level cell NAND architecture as specified, providing the defined FLASH NAND type for system designers.
• Parallel Interface Compatibility: Supports designs requiring parallel memory access and simplifies migration for systems built around parallel FLASH.
• Wide Supply Range: 2.7 V to 3.6 V operation aligns with common 3.3 V system rails for straightforward power integration.
• Compact VLGA Package: 52-VLGA (18x14) package allows high-density board layouts and is suitable for space-constrained assemblies.
• Extended Temperature Range: Rated from -40°C to 85°C to match applications operating across a wide ambient temperature span.

Why Choose MT29F256G08AUAAAC5-ITZ:A TR?

The MT29F256G08AUAAAC5-ITZ:A TR positions itself as a high-density, parallel-interface SLC NAND flash option for engineers needing 256 Gbit of non-volatile storage in a compact 52-VLGA package. Its 2.7 V to 3.6 V supply compatibility and -40°C to 85°C operating range make it suitable for embedded and industrial applications that require stable electrical and thermal performance.

This device is appropriate for designs that prioritize on-board storage capacity, parallel interface integration, and a small package footprint, offering a straightforward storage component choice for system architects and procurement teams focused on reliable, high-capacity FLASH memory.

Request a quote or submit an inquiry for pricing and availability to evaluate MT29F256G08AUAAAC5-ITZ:A TR for your next design.