MT29F512G08CUCDBJ6-6R:D

IC FLASH 512GBIT PAR 132LBGA
Part Description

IC FLASH 512GBIT PAR 132LBGA

Quantity 19 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-LBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size512 GbitAccess TimeN/AGradeCommercial
Clock Frequency166 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging132-LBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F512G08CUCDBJ6-6R:D – IC FLASH 512GBIT PAR 132LBGA

The MT29F512G08CUCDBJ6-6R:D is a 512 Gbit non-volatile NAND flash memory device using MLC technology in a parallel interface format. It delivers a 64G × 8 memory organization in a 132-LBGA (12 × 18) package with a 166 MHz clock frequency.

This device is intended for designs that require large-capacity parallel flash storage with a supply voltage range of 2.7 V to 3.6 V and an ambient operating temperature range of 0 °C to 70 °C.

Key Features

  • Memory Type Non-volatile FLASH NAND (MLC) technology providing persistent storage.
  • Capacity & Organisation 512 Gbit total capacity organized as 64G × 8 for byte-wide access.
  • Interface & Clock Parallel memory interface with a specified clock frequency of 166 MHz.
  • Voltage Supply Operates from 2.7 V to 3.6 V, supporting typical 3.0 V system rails.
  • Package 132-LBGA package (12 × 18 mm) for surface-mount board integration.
  • Operating Temperature Specified ambient range of 0 °C to 70 °C.

Unique Advantages

  • Large non-volatile capacity: 512 Gbit memory size enables substantial on-board storage within a single device.
  • Byte-wide organization: 64G × 8 layout supports straightforward byte-oriented system interfaces.
  • Parallel interface with defined clock: 166 MHz clock frequency provides a clear timing parameter for system integration.
  • Standard LBGA package: 132-LBGA (12 × 18) package supports compact surface-mount implementations.
  • Flexible supply range: 2.7 V to 3.6 V operation accommodates common 3 V embedded power domains.

Why Choose IC FLASH 512GBIT PAR 132LBGA?

The MT29F512G08CUCDBJ6-6R:D positions itself as a high-capacity parallel NAND flash option combining MLC flash technology, a byte-wide 64G × 8 organization, and a 132-LBGA package for compact system integration. Its defined electrical and thermal ranges—2.7 V to 3.6 V and 0 °C to 70 °C—make it suitable for designs that require explicit operating conditions and a known package footprint.

This device is appropriate for designers and procurement teams specifying 512 Gbit parallel flash storage where MLC NAND, a parallel interface, and the 132-LBGA package are required design attributes.

Request a quote or submit an inquiry to discuss pricing and availability for the MT29F512G08CUCDBJ6-6R:D.

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