MT29F64G08AFAAAWP:A

The MT29F64G08AFAAAWP:A is a 64 Gbit non-volatile NAND flash memory device from Micron Technology Inc. Implemented as an 8G × 8 memory organization with a parallel memory interface, it provides high-density solid-state storage in a standard TSOP package.

Designed for systems that require parallel flash memory with a 2.7 V to 3.6 V supply and commercial-temperature operation, this device targets embedded and electronic equipment applications where compact, high-capacity non-volatile storage is required.

Key Features

• Memory Type  Non-volatile FLASH NAND memory providing persistent storage without power.
• Capacity & Organization  64 Gbit total capacity organized as 8G × 8 for byte-wide parallel access.
• Interface & Voltage  Parallel memory interface compatible with a 2.7 V to 3.6 V supply range, enabling integration into a variety of 3.3 V systems.
• Package  Supplied in a 48-TSOP I package (48-TFSOP, 0.724" / 18.40 mm width) for surface-mount PCB assembly.
• Operating Temperature  Rated for commercial operation from 0°C to 70°C (TA), suitable for standard ambient conditions.

Typical Applications

• Embedded Systems  Provides high-density non-volatile storage for firmware, code images, or bulk data in embedded controllers and modules that require parallel flash.
• Consumer Electronics  Used where compact, high-capacity parallel NAND storage is needed for media, system code, or persistent configuration data.
• Networking and Communications Equipment  Supports system storage requirements in networking appliances and comms devices that accommodate parallel flash memory and operate within the listed voltage and temperature ranges.

Unique Advantages

• High storage density: 64 Gbit capacity enables consolidation of firmware and data storage into a single device, reducing board-level component count.
• Byte-wide parallel organization: The 8G × 8 arrangement simplifies interfacing with parallel memory controllers and legacy parallel buses.
• Flexible supply range: Support for 2.7 V to 3.6 V operation fits common 3.3 V system rails for straightforward power integration.
• Standard TSOP form factor: 48-TSOP I package (18.40 mm width) offers a compact, industry-standard footprint for surface-mount designs.
• Commercial temperature rating: 0°C to 70°C operation aligns with typical ambient conditions for many consumer and industrial electronic products.

Why Choose IC FLASH 64GBIT PAR 48TSOP I?

The MT29F64G08AFAAAWP:A delivers a high-capacity, parallel NAND flash option in a standard 48-TSOP I package, combining 64 Gbit density with a byte-wide 8G × 8 organization. Its 2.7 V–3.6 V supply compatibility and commercial temperature rating make it a practical choice for designs that require sizable non-volatile storage without custom packaging or special power rails.

This device is suited to engineers and procurement teams specifying parallel flash memory for embedded systems, consumer electronics, and network equipment that operate within the provided electrical and thermal ranges and that benefit from a compact, surface-mount TSOP footprint.

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