MT29F64G08AMCBBH2-12:B TR
| Part Description |
IC FLASH 64GBIT PARALLEL 100TBGA |
|---|---|
| Quantity | 127 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 83 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F64G08AMCBBH2-12:B TR – IC FLASH 64GBIT PARALLEL 100TBGA
The MT29F64G08AMCBBH2-12:B TR is a 64 Gbit non-volatile NAND flash memory device in a parallel interface configuration. It is a FLASH - NAND architecture organized as 8G × 8, designed to provide high-density parallel storage in a compact 100‑TBGA package.
Key device characteristics include a 64 Gbit memory size, support for an 83 MHz clock, a 2.7 V to 3.6 V supply range, and an operating ambient temperature range of 0°C to 70°C—attributes intended for systems requiring parallel NAND storage with defined voltage and temperature specifications.
Key Features
- Memory Core Non-volatile FLASH - NAND memory with a total capacity of 64 Gbit arranged in an 8G × 8 organization for parallel data access.
- Interface & Performance Parallel memory interface supporting a clock frequency of 83 MHz to match parallel bus timing requirements.
- Voltage Supply Operates from 2.7 V to 3.6 V, accommodating common 3 V system power domains.
- Operating Temperature Specified ambient operating range of 0°C to 70°C (TA) for standard temperature environments.
- Package & Mounting Supplied in a 100‑TBGA package (12x18) for surface-mount applications where compact, high-density packaging is required.
- Memory Format & Organization FLASH memory format with 8G × 8 organization for straightforward mapping to parallel bus architectures.
Typical Applications
- Embedded Storage Systems Provides parallel NAND flash capacity for embedded designs that require 64 Gbit non-volatile storage.
- Legacy Parallel Interface Designs Suits systems that use a parallel memory interface and need a compact BGA footprint.
- Industrial and Consumer Electronics Fits products operating within 0°C to 70°C that need onboard flash storage with a 2.7 V–3.6 V supply.
Unique Advantages
- High-density Storage in a Compact Package: 64 Gbit NAND capacity packaged in a 100‑TBGA (12x18) reduces board area for high-density designs.
- Parallel Interface Support: Parallel memory organization and 8G × 8 layout provide compatibility with parallel bus architectures.
- Defined Clock Support: Supports an 83 MHz clock frequency for synchronous parallel operation.
- Flexible Supply Range: Operates across a 2.7 V to 3.6 V supply window to integrate with common 3 V systems.
- Standard Temperature Rating: Rated for 0°C to 70°C ambient operation for use in standard-temperature environments.
- Manufacturer Backing: Device is manufactured by Micron Technology Inc., providing traceability to a known supplier.
Why Choose MT29F64G08AMCBBH2-12:B TR?
The MT29F64G08AMCBBH2-12:B TR positions itself as a straightforward, high-density parallel NAND flash option for designs that require 64 Gbit of non-volatile storage in a compact BGA package. Its specified clock frequency, voltage range, and operating temperature make it suitable for systems that must meet concrete electrical and thermal constraints.
This device is well-suited for engineers and procurement teams specifying parallel FLASH memory from a recognized manufacturer (Micron Technology Inc.) who need clear, verifiable device parameters—capacity, interface type, package, supply voltage, and operating temperature—to match system requirements.
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