MT46V32M16P-6T:C TR

IC DRAM 512MBIT PAR 66TSOP
Part Description

IC DRAM 512MBIT PAR 66TSOP

Quantity 510 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency167 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M16P-6T:C TR – 512 Mbit Parallel DDR SDRAM, 66‑TSSOP

The MT46V32M16P-6T:C TR is a 512 Mbit DDR SDRAM organized as 32M × 16, offered by Micron Technology Inc. It implements a parallel memory interface delivering a clock frequency of 167 MHz and an access time of 700 ps.

Designed for board-level memory expansion where standard-temperature operation and compact packaging are required, the device provides a low-voltage supply range (2.3 V to 2.7 V) in a 66‑TSSOP (0.400", 10.16 mm width) package.

Key Features

  • Core / Memory Architecture 512 Mbit DRAM organized as 32M × 16 providing byte-wide parallel access in a standard DRAM format.
  • Technology DDR SDRAM technology with a parallel memory interface for synchronous data transfers.
  • Performance Clock frequency of 167 MHz and an access time of 700 ps; write cycle time (word/page) of 15 ns for predictable timing behavior.
  • Power Operates from a 2.3 V to 2.7 V supply range to support low-voltage system designs.
  • Package & Temperature Supplied in a 66‑TSSOP package (0.400", 10.16 mm width) with an operating ambient temperature range of 0 °C to 70 °C (TA).
  • Interface Parallel memory interface suitable for systems using standard DDR DRAM topologies.

Typical Applications

  • Board-level memory expansion — Adds 512 Mbit of DDR SDRAM capacity for systems requiring parallel DRAM storage and predictable timing.
  • Embedded systems — Provides low-voltage DDR memory in a compact 66‑TSSOP package for space-constrained modules operating at standard temperatures.
  • Memory subsystems — Suited for designs that require a 32M × 16 organization and standard DDR timing characteristics.
  • Prototyping and evaluation — Useful for evaluating parallel DDR performance at 167 MHz clock rates and 700 ps access times.

Unique Advantages

  • Defined memory organization: 32M × 16 layout simplifies address mapping and board-level memory planning.
  • Compact package footprint: 66‑TSSOP (0.400", 10.16 mm) allows integration into space-limited PCBs.
  • Low-voltage operation: 2.3 V–2.7 V supply reduces system power and aligns with low-voltage DDR domains.
  • Predictable timing: 167 MHz clock and 700 ps access time with a 15 ns write cycle time for consistent performance characterization.
  • Standard-temperature rating: Operating range of 0 °C to 70 °C supports typical commercial deployments.

Why Choose IC DRAM 512MBIT PAR 66TSOP?

The MT46V32M16P-6T:C TR positions itself as a straightforward, low-voltage DDR SDRAM option for designs that require 512 Mbit of parallel DRAM with a 32M × 16 organization. Its combination of 167 MHz clocking, 700 ps access time, and a compact 66‑TSSOP package makes it suitable for systems prioritizing predictable timing and PCB space efficiency.

This device is appropriate for engineers specifying board-level memory expansion or embedded modules operating at commercial temperatures. The clear electrical and mechanical parameters simplify integration, qualification, and long-term BOM planning.

If you need pricing, availability, or a formal quote for MT46V32M16P-6T:C TR, request a quote or submit an inquiry to our sales team for further assistance.

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