MT46V32M16TG-5B:C TR

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 967 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M16TG-5B:C TR – IC DRAM 512MBIT PARALLEL 66TSOP

The MT46V32M16TG-5B:C TR is a 512 Mbit DRAM device implemented as DDR SDRAM with a 32M × 16 memory organization. It provides a parallel memory interface and is supplied in a 66-TSSOP package sized 0.400" (10.16 mm) in width.

Designed for systems that require a parallel DDR memory element, the device operates from a 2.5 V to 2.7 V supply and supports an operating ambient temperature range of 0 °C to 70 °C (TA), offering defined timing and electrical characteristics for integration into parallel-memory designs.

Key Features

  • Memory Core 512 Mbit DRAM organized as 32M × 16, implemented as DDR SDRAM for parallel memory architectures.
  • Performance Supports a clock frequency of 200 MHz with an access time of 700 ps and a write cycle time (word/page) of 15 ns.
  • Interface Parallel memory interface suitable for designs requiring parallel DRAM connectivity.
  • Power Operates from a 2.5 V to 2.7 V supply voltage range.
  • Package 66-TSSOP (0.400", 10.16 mm width) supplier device package for surface-mount PCB implementations.
  • Temperature Range Specified for an operating ambient temperature of 0 °C to 70 °C (TA).
  • Memory Format Volatile DRAM intended for temporary data storage in systems using parallel memory components.

Typical Applications

  • Parallel memory subsystems — Integration as a 512 Mbit DDR SDRAM device in systems that use parallel DRAM interfaces.
  • Board-level memory expansion — Provides additional 32M × 16 memory capacity on PCBs requiring a 66-TSSOP package footprint.
  • Data buffering — Used where volatile, parallel-access DRAM is required for temporary storage and staging of data.

Unique Advantages

  • Defined DDR SDRAM architecture — 32M × 16 organization and DDR technology provide a clear memory structure for parallel implementations.
  • Deterministic timing specs — 200 MHz clock frequency, 700 ps access time, and 15 ns write cycle time support predictable timing analysis.
  • Industry-standard supply range — 2.5 V to 2.7 V operation aligns with systems designed around this voltage domain.
  • Space-efficient package — 66-TSSOP (0.400", 10.16 mm width) enables surface-mount integration on compact PCBs.
  • Commercial temperature coverage — Specified operation from 0 °C to 70 °C (TA) for typical commercial environments.

Why Choose MT46V32M16TG-5B:C TR?

The MT46V32M16TG-5B:C TR delivers a clearly defined 512 Mbit DDR SDRAM building block for designs that require parallel memory organization, deterministic timing, and a compact 66-TSSOP footprint. Its 32M × 16 architecture, 200 MHz clock support, and documented timing values make it suitable for integration where parallel DRAM elements are required.

This device is suited to engineers and procurement teams specifying board-level DRAM components in systems that operate within a 2.5 V–2.7 V supply environment and a 0 °C–70 °C ambient temperature range, offering predictable electrical and mechanical characteristics for ongoing product designs.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the MT46V32M16TG-5B:C TR.

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